|
IDT79RC32V334-133BBI8 |
IDT79RC32V334-150BBI8 |
IDT79RC32V334-133BB8 |
IDT79RC32V334-150BB8 |
Description |
RISC Microcontroller, 32-Bit, 133MHz, PBGA256, 17 X 17 MM, PLASTIC, BGA-256 |
RISC Microcontroller, 32-Bit, 150MHz, PBGA256, 17 X 17 MM, PLASTIC, BGA-256 |
RISC Microcontroller, 32-Bit, 133MHz, PBGA256, 17 X 17 MM, PLASTIC, BGA-256 |
RISC Microcontroller, 32-Bit, 150MHz, PBGA256, 17 X 17 MM, PLASTIC, BGA-256 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
Parts packaging code |
BGA |
BGA |
BGA |
BGA |
package instruction |
17 X 17 MM, PLASTIC, BGA-256 |
17 X 17 MM, PLASTIC, BGA-256 |
17 X 17 MM, PLASTIC, BGA-256 |
17 X 17 MM, PLASTIC, BGA-256 |
Contacts |
256 |
256 |
256 |
256 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
ECCN code |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
Has ADC |
NO |
NO |
NO |
NO |
Address bus width |
32 |
32 |
32 |
32 |
bit size |
32 |
32 |
32 |
32 |
maximum clock frequency |
66.66 MHz |
75 MHz |
66.66 MHz |
75 MHz |
DAC channel |
NO |
NO |
NO |
NO |
DMA channel |
YES |
YES |
YES |
YES |
External data bus width |
32 |
32 |
32 |
32 |
JESD-30 code |
S-PBGA-B256 |
S-PBGA-B256 |
S-PBGA-B256 |
S-PBGA-B256 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
length |
17 mm |
17 mm |
17 mm |
17 mm |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
Number of I/O lines |
16 |
16 |
16 |
16 |
Number of terminals |
256 |
256 |
256 |
256 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
PWM channel |
NO |
NO |
NO |
NO |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
BGA |
BGA |
Encapsulate equivalent code |
BGA256,16X16,40 |
BGA256,16X16,40 |
BGA256,16X16,40 |
BGA256,16X16,40 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
225 |
225 |
225 |
225 |
power supply |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
3.5 mm |
3.5 mm |
3.5 mm |
3.5 mm |
speed |
133 MHz |
150 MHz |
133 MHz |
150 MHz |
Maximum slew rate |
630 mA |
700 mA |
630 mA |
700 mA |
Maximum supply voltage |
3.465 V |
3.465 V |
3.465 V |
3.465 V |
Minimum supply voltage |
3.135 V |
3.135 V |
3.135 V |
3.135 V |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
OTHER |
OTHER |
Terminal surface |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn63Pb37) |
Terminal form |
BALL |
BALL |
BALL |
BALL |
Terminal pitch |
1 mm |
1 mm |
1 mm |
1 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
20 |
20 |
20 |
20 |
width |
17 mm |
17 mm |
17 mm |
17 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
Base Number Matches |
1 |
1 |
1 |
1 |