Standard SRAM, 64KX24, 10ns, CMOS, PQFP100, PLASTIC, QFP-100
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Integrated Silicon Solution ( ISSI ) |
Parts packaging code | QFP |
package instruction | PLASTIC, QFP-100 |
Contacts | 100 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 10 ns |
Other features | LOW POWER STANDBY MODE |
I/O type | COMMON |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e0 |
length | 20 mm |
memory density | 1572864 bit |
Memory IC Type | STANDARD SRAM |
memory width | 24 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX24 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP100,.7X.9 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 3.22 mm |
Maximum standby current | 0.02 A |
Minimum standby current | 3 V |
Maximum slew rate | 0.19 mA |
Maximum supply voltage (Vsup) | 3.63 V |
Minimum supply voltage (Vsup) | 2.97 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
Base Number Matches | 1 |
IS61LV6424-10PQ | IS61LV6424-20PQ | IS61LV6424-20PQI | IS61LV6424-20TQI | IS61LV6424-15PQ | IS61LV6424-15PQI | IS61LV6424-20TQ | IS61LV6424-12PQI | IS61LV6424-12PQ | |
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Description | Standard SRAM, 64KX24, 10ns, CMOS, PQFP100, PLASTIC, QFP-100 | Standard SRAM, 64KX24, 20ns, CMOS, PQFP100, PLASTIC, QFP-100 | Standard SRAM, 64KX24, 20ns, CMOS, PQFP100, PLASTIC, QFP-100 | Standard SRAM, 64KX24, 20ns, CMOS, PQFP100, TQFP-100 | Standard SRAM, 64KX24, 15ns, CMOS, PQFP100, PLASTIC, QFP-100 | Standard SRAM, 64KX24, 15ns, CMOS, PQFP100, PLASTIC, QFP-100 | Standard SRAM, 64KX24, 20ns, CMOS, PQFP100, TQFP-100 | Standard SRAM, 64KX24, 12ns, CMOS, PQFP100, PLASTIC, QFP-100 | Standard SRAM, 64KX24, 12ns, CMOS, PQFP100, PLASTIC, QFP-100 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
package instruction | PLASTIC, QFP-100 | PLASTIC, QFP-100 | PLASTIC, QFP-100 | TQFP-100 | PLASTIC, QFP-100 | PLASTIC, QFP-100 | TQFP-100 | PLASTIC, QFP-100 | PLASTIC, QFP-100 |
Contacts | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 10 ns | 20 ns | 20 ns | 20 ns | 15 ns | 15 ns | 20 ns | 12 ns | 12 ns |
Other features | LOW POWER STANDBY MODE | LOW POWER STANDBY MODE | LOW POWER STANDBY MODE | LOW POWER STANDBY MODE | LOW POWER STANDBY MODE | LOW POWER STANDBY MODE | LOW POWER STANDBY MODE | LOW POWER STANDBY MODE | LOW POWER STANDBY MODE |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
memory density | 1572864 bit | 1572864 bit | 1572864 bit | 1572864 bit | 1572864 bit | 1572864 bit | 1572864 bit | 1572864 bit | 1572864 bi |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
organize | 64KX24 | 64KX24 | 64KX24 | 64KX24 | 64KX24 | 64KX24 | 64KX24 | 64KX24 | 64KX24 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QFP | QFP | LQFP | QFP | QFP | LQFP | QFP | QFP |
Encapsulate equivalent code | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.63X.87 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.63X.87 | QFP100,.7X.9 | QFP100,.7X.9 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.22 mm | 3.22 mm | 3.22 mm | 1.6 mm | 3.22 mm | 3.22 mm | 1.6 mm | 3.22 mm | 3.22 mm |
Maximum standby current | 0.02 A | 0.02 A | 0.025 A | 0.025 A | 0.02 A | 0.025 A | 0.02 A | 0.025 A | 0.02 A |
Minimum standby current | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Maximum slew rate | 0.19 mA | 0.14 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.17 mA | 0.14 mA | 0.19 mA | 0.17 mA |
Maximum supply voltage (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
Minimum supply voltage (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |