Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDFP14, CERAMIC, DFP-14
Parameter Name | Attribute value |
Maker | Harris |
package instruction | DFP, |
Reach Compliance Code | unknown |
Counting direction | UP |
series | HCT |
JESD-30 code | R-CDFP-F14 |
JESD-609 code | e4 |
Load capacitance (CL) | 50 pF |
Load/preset input | YES |
Logic integrated circuit type | BINARY COUNTER |
Operating mode | ASYNCHRONOUS |
Number of digits | 4 |
Number of functions | 2 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DFP |
Package shape | RECTANGULAR |
Package form | FLATPACK |
propagation delay (tpd) | 59 ns |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | GOLD |
Terminal form | FLAT |
Terminal location | DUAL |
total dose | 100k Rad(Si) V |
Trigger type | NEGATIVE EDGE |
Base Number Matches | 1 |
5962R9575001VXC | HCTS393D/SAMPLE | 5962R9575001VCC | HCTS393K/SAMPLE | 5962R9575001V9A | HCTS393HMSR | HCTS393DMSR | |
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Description | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDFP14, CERAMIC, DFP-14 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDIP14, | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDIP14, CERAMIC, DIP-14 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDFP14 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, DIE-14 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDIP14, |
package instruction | DFP, | , | DIP, | , | DIE, | DIE, | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Counting direction | UP | UP | UP | UP | UP | UP | UP |
series | HCT | HCT | HCT | HCT | HCT | HCT | HCT |
JESD-30 code | R-CDFP-F14 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 | X-XUUC-N14 | X-XUUC-N14 | R-CDIP-T14 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Load/preset input | YES | YES | YES | YES | YES | YES | NO |
Logic integrated circuit type | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Number of digits | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED | RECTANGULAR |
Package form | FLATPACK | IN-LINE | IN-LINE | FLATPACK | UNCASED CHIP | UNCASED CHIP | IN-LINE |
propagation delay (tpd) | 59 ns | 59 ns | 59 ns | 59 ns | 59 ns | 59 ns | 59 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO | YES | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL | DUAL | UPPER | UPPER | DUAL |
Trigger type | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Maker | Harris | Harris | - | Harris | - | Harris | Harris |
JESD-609 code | e4 | - | e4 | - | e0 | - | e0 |
Maximum operating temperature | 125 °C | - | 125 °C | - | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | - | -55 °C | - | -55 °C | -55 °C | -55 °C |
encapsulated code | DFP | - | DIP | - | DIE | DIE | DIP |
Temperature level | MILITARY | - | MILITARY | - | MILITARY | MILITARY | MILITARY |
Terminal surface | GOLD | - | GOLD | - | TIN LEAD | - | Tin/Lead (Sn/Pb) |
total dose | 100k Rad(Si) V | - | 100k Rad(Si) V | - | 100k Rad(Si) V | - | 200k Rad(Si) V |