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MSP3B38R30FT17E3

Description
RESISTOR, WIRE WOUND, 2.5 W, 1 %, 25 ppm, 38.3 ohm, SURFACE MOUNT, 5828, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size344KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

MSP3B38R30FT17E3 Overview

RESISTOR, WIRE WOUND, 2.5 W, 1 %, 25 ppm, 38.3 ohm, SURFACE MOUNT, 5828, CHIP, ROHS COMPLIANT

MSP3B38R30FT17E3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionSMT, 5828
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresPRECISION
structureChip
JESD-609 codee3
Manufacturer's serial numberMSP
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature275 °C
Minimum operating temperature-55 °C
Package height6.6 mm
Package length14.8 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width7 mm
method of packingTUBE
Rated power dissipation(P)2.5 W
Rated temperature25 °C
resistance38.3 Ω
Resistor typeFIXED RESISTOR
seriesMSP
size code5828
surface mountYES
technologyWIRE WOUND
Temperature Coefficient25 ppm/°C
Terminal surfaceMatte Tin (Sn)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage200 V
Base Number Matches1
MSP
Vishay Sfernice
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
FEATURES
Approved according CECC 40402-801
(wirewound)
Wide range of ohmic values (0.04
Ω
to 1 MΩ)
Low temperature coefficient
(± 25 ppm/°C available)
Good electrical insulation
All welded construction and molded encapsulant
High power ratings (up to 2.5 W)
Stability class 0.5
Pure matte tin termination
Compliant to RoHS directive 2002/95/EC
Specially designed for surface mounting, the MSP series uses either wirewound or metal film technology. The molded package
ensures mechanical and climatic protection as well as high dielectric insulation. The MSP design is compatible with surface
mounting equipment and can withstand wave and reflow soldering techniques.
DIMENSIONS
in millimeters
Recommended Soldering Areas
E
A
C
Z
B
W
F
F
D
X
X
SERIES AND
STYLES
MSP 1
MSP 2
MSP 3
A
6.9
11.4
14.8
B
3.8
5
6.6
C
3.8
7
7
D
2.5
5
5
E
6.5
11
14.4
F
1.4
2.4
2.4
W
2.7
5.2
5.2
X
2.9
4.1
4.1
Z
6
9.4
12.7
AVERAGE MASS
(g)
0.2
0.8
1.5
Note
• General tolerance: ± 0.2 mm
TECHNICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Vishay Sfernice Series
CECC 40402-801
Metric Size
Rated Dissipation at + 25 °C,
P
25
± 5 % E24 Series
Ohmic Range in
Relation to
Tolerance
(with Prefered
Ohmic
Value Series)
± 2 % E48 Series
± 1 % E96 Series
± 0.5 % E96 Series
± 0.1 % E192 Series
Approved Range
1 % or
CECC 40402-801
Class 0.5
Limiting Element Voltage,
U
max.
AC/DC
www.vishay.com
14
MSP 1 B
RW1
0704M
1W
0.04 to
2.2K
0.04 to
2.2K
0.04 to
2.2K
0.4 to
2.2K
-
0.5
1K
50 V
WIREWOUND
MSP 2 B
RW2
1107M
2W
0.04 to
4.7K
0.04 to
4.7K
0.04 to
4.7K
0.4 to
4.7K
-
0.5
2.2K
120 V
MSP 3 B
RW3
1607M
2.5 W
0.04 to
13K
0.05 to
13K
0.05 to
13K
0.3 to
13K
-
0.1
4.12K
200 V
MSP 1 C
-
0704M
0.5 W
-
-
10 to
332K
10 to
332K
10
332K
-
300 V
METAL FILM
MSP 2 C
-
1107M
1W
-
-
10 to
1M
10 to
1M
10
332K
-
350 V
Document Number: 50003
Revision: 02-Oct-09
For technical questions, contact:
sfer@vishay.com
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