Standard SRAM, 64KX1, 30ns, CMOS, CDFP24, CERPACK-24
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | DFP |
package instruction | DFP, FL24,.4 |
Contacts | 24 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 30 ns |
I/O type | SEPARATE |
JESD-30 code | R-GDFP-F24 |
JESD-609 code | e0 |
length | 15.748 mm |
memory density | 65536 bit |
Memory IC Type | STANDARD SRAM |
memory width | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 24 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX1 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DFP |
Encapsulate equivalent code | FL24,.4 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 2.286 mm |
Maximum standby current | 0.00015 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.095 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 9.144 mm |
Base Number Matches | 1 |