Tputty
TM
502 Series
Innovative
Technology
for a
Connected
World
CreaTeS CoMpreSSion of inTerfaCe MaTerial
Tputty™ 502 is the best material for applications where large tolerance
differences create the need for compression of the interface material beyond
50% of its original thickness.
Tputty™ 502 will flow and ensure low pressures on the components being
cooled. In conjunction with outstanding compression characteristics, Tputty™ 502
has a high thermal conductivity, resulting in very low thermal resistance.
Tputty™ 502 is naturally tacky and requires no additional adhesive coating that
can inhibit thermal performance.
feaTUreS anD BenefiTS
• Soft and ultra high compressibility for
low stress applications
• 3 W/mK thermal conductivity
• Available in sheets 0.020” - 0.200”
(0.5mm - (5.0mm) thick and in bulk
• Naturally tacky needing no further
adhesive coating
appliCaTionS
• Cooling components to the
chassis or frame
• Entire large panel PCB cooling
• Semiconductor automated test
equipment (ATE)
• Any high compression low
stress application
global
solutions:
local
support
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
Tputty
TM
502 Series
Innovative
Technology
for a
Connected
World
Tputty™ 0.020
Tputty™ 0.040
Tputty™ 0.060
Tputty™ 0.080
Tputty™ 0.100
TEST METHOD
Construction &
Composition
Color
Thickness
Thickness Tolerance
Specific Gravity
Hardness *without
fiberglass
Outgassing TML
(Post Cured)
Outgassing CVCM
(Post Cured)
Temperature Range
Thermal
Conductivity
Thermal Impedance
@ 10 psi @ 69KPa
Thermal Expansion
Breakdown Voltage
Volume Resistivity
Dielectric Constant
@ 1MHz
Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride
filled silicone elastomer filled silicone elastomer filled silicone elastomer filled silicone elastomer filled silicone elastomer
White
0.020” (0.51mm)
± 0.002” (± 0.05mm)
1.39 g/cc
05 Shore OO
0.11%
0.06%
-45°C to 200°C
3 W/mK
0.44 °C-in
2
/W 2.84
°C-cm
2
/W
92 ppm/C
2000 Volts AC
5 x 10
13
ohm-cm
3.20
White
0.040” (1.02mm)
± 0.003” (± 0.08mm)
1.38 g/cc
05 Shore OO
0.11%
0.06%
-45°C to 200°C
3 W/mK
0.49 °C-in
2
/W 3.16
°C-cm
2
/W
92 ppm/C
4000 Volts AC
5 x 10
13
ohm-cm
3.20
White
0.060” (1.52mm)
± 0.004” (± 0.10mm)
1.37 g/cc
05 Shore OO
0.11%
0.06%
-45°C to 200°C
3 W/mK
0.53 °C-in
2
/W 3.42
°C-cm
2
/W
92 ppm/C
>5000 Volts AC
5 x 10
13
ohm-cm
3.20
White
0.080” (2.03mm)
± 0.004” (± 0.10mm)
1.37 g/cc
05 Shore OO
0.11%
0.06%
-45°C to 200°C
3 W/mK
0.58 °C-in
2
/W 3.74
°C-cm
2
/W
92 ppm/C
>5000 Volts AC
5 x 10
13
ohm-cm
3.20
White
0.100” (2.54mm)
± 0.005” (± 0.13mm)
1.36 g/cc
05 Shore OO
0.11%
0.06%
-45°C to 200°C
3 W/mK
0.62 °C-in
2
/W 4.00
°C-cm
2
/W
92 ppm/C
>5000 Volts AC
5 x 10
13
ohm-cm
3.20
ASTM D5470
(modified)
ASTM D5470
(modified)
IPC-TM-650
2.4.24
ASTM D149
ASTM D257
ASTM D150
Helium
Pycnometer
ASTM D2240
ASTM E595
ASTM E595
Visual
STanDarD ThiCkneSSeS
0.020” (0.51mm)
0.060” (1.52mm)
0.100” (2.54mm)
0.140” (3.56mm)
0.180” (4.57mm)
0.030” (0.76mm)
0.070” (1.78mm)
0.110” (2.79mm)
0.150” (3.81mm)
0.190” (4.83mm)
0.040” (1.02mm)
0.080” (2.03mm)
0.120” (3.05mm)
0.160” (4.06mm)
0.200” (5.08mm)
0.050” (1.27mm)
0.090” (2.29mm)
0.130” (3.30mm)
0.170” (4.32mm)
STanDarD SheeT SizeS
9” x 9” (229mm x 229mm) and 18” x 18” (457mm x 457mm).
9” x 9” only over 0.100” thickness
Tputty™ 502 is available in individual die cut shapes. Pressure sensitive adhesive is not
applicable for Tputty™ products.
Consult the factory for alternate thicknesses.
reinforCeMenT
Tputty™ 502 sheets are reinforced on both sides with fiberglass.
BUlk
Tputty™ 502 is available in bulk form in the following sizes:
100 cc Jar 500 cc Jar 1000 cc Jar
Consult the factory for alternate bulk sizes.
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
THR-SPEC-Tputty-502 0710
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and ap-
plication of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,
merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All
Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird
Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
A13502-00 Rev G, 2/05/07
Microcontroller MCU
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