|
A10238-09 |
A10240-05 |
A10235-31 |
A10247-04 |
A10237-22 |
A10247-05 |
A10235-36 |
A10874-12 |
A10233-30 |
A10874-01 |
Description |
RF Amplifier 4-14 GHz LNA Self Biased |
RF Cable Assemblies U.FL TO U.FL M ASBLY 200MM 1.32DIA GRAY |
Thermal Interface Products Tputty 502 60 FG2 9x9" 3W/mK XSoft |
Thermal Interface Products Tputty 502 180 FG2 9x9" 3W/mK XSoft |
Thermal Interface Products Tputty 502 80 FG2 18x18" 3W/mK XSoft |
Thermal Interface Products Tputty 502 180 FG2 18x18" 3W/mK XSoft |
Thermal Interface Products Tputty 502 60 FG2 18x18" 3W/mK XSoft |
Thermal Interface Products Tputty 502 30 FG2 18x18" 3W/mK XSoft |
Thermal Interface Products Tputty 502 40 FG2 9x9" 3W/mK XSoft |
Thermal Interface Products Tflex 660 DC1 9x9" 3.0W/mK gap filler |
Product Category |
Thermal Interface Products |
Thermal Interface Products |
Thermal Interface Products |
Thermal Interface Products |
Thermal Interface Products |
Thermal Interface Products |
Thermal Interface Products |
Thermal Interface Products |
Thermal Interface Products |
Thermal Interface Products |
Manufacturer |
LSR |
LSR |
LSR |
LSR |
LSR |
LSR |
LSR |
LSR |
LSR |
LSR |
RoHS |
Details |
Details |
Details |
Details |
Details |
Details |
Details |
Details |
Details |
Details |
Type |
Thermal Adhesive Compound |
Thermally Conductive Gap Pad |
Thermal Adhesive Compound |
Thermally Conductive Gap Pad |
Thermally Conductive Gap Pad |
Thermally Conductive Gap Pad |
Thermal Adhesive Compound |
Thermal Adhesive Compound |
Thermal Adhesive Compound |
Thermally Conductive Gap Pad |
Factory Pack Quantity |
1 |
1 |
1 |
1 |
1 |
- |
1 |
1 |
1 |
1 |