|
CAT1021WI25 |
CAT1021WI45 |
CAT1023YI-28-T3 |
CAT1023LI30 |
CAT1021ZI45 |
CAT1022YI-30-T3 |
CAT1021YI-30-T3 |
CAT1021YI-28-T3 |
Description |
Supervisory Circuits 2K bit 2.5V Ind Temp |
Supervisory Circuits CPU Supervisor with 2K EEPROM |
Supervisory Circuits 2K bit 2.8V Ind Temp |
Supervisory Circuits 2K bit 3V Ind Temp |
Supervisory Circuits 2K bit 4.5V Ind Temp |
Supervisory Circuits 2K bit 3V Ind Temp |
Supervisory Circuits 2K bit 3V Ind Temp |
Supervisory Circuits 2K bit 2.8V Ind Temp |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
package instruction |
SOP, SOP8,.25 |
0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, MS-012, SOIC-8 |
TSSOP, TSSOP8,.25 |
0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8 |
HALOGEN FREE AND ROHS COMPLIANT, MO-187AA, MSOP-8 |
TSSOP, TSSOP8,.25 |
TSSOP, TSSOP8,.25 |
TSSOP, TSSOP8,.25 |
Reach Compliance Code |
compliant |
compliant |
compliant |
unknown |
unknown |
compliant |
unknown |
unknown |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDIP-T8 |
S-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
SOP |
TSSOP |
DIP |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
Encapsulate equivalent code |
SOP8,.25 |
SOP8,.25 |
TSSOP8,.25 |
DIP8,.3 |
TSSOP8,.19 |
TSSOP8,.25 |
TSSOP8,.25 |
TSSOP8,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
power supply |
3.3/5 V |
3.3/5 V |
3.3 V |
3.3/5 V |
3.3/5 V |
3.3 V |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Nominal supply voltage (Vsup) |
3 V |
5 V |
3.3 V |
3.3 V |
5 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
NO |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
0.635 mm |
2.54 mm |
0.65 mm |
0.635 mm |
0.635 mm |
0.635 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maker |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
- |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
Humidity sensitivity level |
1 |
1 |
1 |
- |
1 |
1 |
- |
- |