MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
Rev. 3.1 — 21 December 2010
145631
Product short data sheet
PUBLIC
1. General description
MIFARE DESFire EV1 (MF3ICD(H) 21/41/81), a Common Criteria (EAL4+) certified
product, is ideal for service providers wanting to use secure multi-application smart cards
in public transport schemes, access managment or closed-loop e-payment applications. It
is fully complies with the requirements for fast and highly secure data transmission,
flexible memory organization and interoperability with existing infrastructure.
MIFARE DESFire EV1 is based on open global standards for both air interface and
cryptographic methods. It is compliant to all 4 levels of ISO/IEC 14443A and uses optional
ISO/IEC 7816-4 commands.
Featuring an on-chip backup management system and the mutual three pass
authentication, a MIFARE DESFire EV1 card can hold up to 28 different applications and
32 files per application. The size of each file is defined at the moment of its creation,
making MIFARE DESFire EV1 a truly flexible and convenient product.
Additionally, an automatic anti-tear mechanism is available for all file types, which
guarantees transaction oriented data integrity. With MIFARE DESFire EV1, data transfer
rates up to 848 kbit/s can be achieved, allowing fast data transmission.
The main characteristics of this device are denoted by its name “DESFire”: DES indicates
the high level of security using a 3DES or AES hardware cryptographic engine for
enciphering transmission data and Fire indicates its outstanding position as a fast,
innovative, reliable and secure IC in the contactless proximity transaction market. Hence,
MIFARE DESFire EV1 brings many benefits to end users. Cardholders can experience
convenient contactless ticketing while also having the possibility to use the same device
for related applications such as payment at vending machines, access control or event
ticketing. In other words, the MIFARE DESFire EV1 silicon solution offers enhanced
consumer-friendly system design, in combination with security and reliability.
MIFARE DESFire EV1 delivers the perfect balance of speed, performance and cost
efficiency. Its open concept allows future seamless integration of other ticketing media
such as smart paper tickets, key fobs, and mobile ticketing based on Near Field
Communication (NFC) technology. It is also fully compatible with the existing MIFARE
reader hardware platform. MIFARE DESFire EV1 is your ticket to contactless systems
worldwide.
NXP Semiconductors
MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
2. Features and benefits
2.1 RF interface: ISO/IEC 14443 Type A
Contactless transmission of data and powered by the RF-field (no battery needed)
Operating distance: up to 100 mm (depending on power provided by the PCD and
antenna geometry)
Operating frequency: 13.56 MHz
Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s
High data integrity: 16/32 bit CRC, parity, bit coding, bit counting
True deterministic anticollision
7 bytes unique identifier (cascade level 2 according to ISO/IEC 14443-3 and option for
random ID)
Uses ISO/IEC 14443-4 protocol
2.2 ISO/IEC 7816 compatibility
Supports ISO/IEC 7816-3 APDU message structure
Supports ISO/IEC 7816-4 INS code ‘A4’ for SELECT FILE
Supports ISO/IEC 7816-4 INS code ‘B0’ for READ BINARY
Supports ISO/IEC 7816-4 INS code ‘D6’ for UPDATE BINARY
Supports ISO/IEC 7816-4 INS code ‘B2’ for READ RECORDS
Supports ISO/IEC 7816-4 INS code ‘E2’ for APPEND RECORD
Supports ISO/IEC 7816-4 INS code ‘84’ for GET CHALLENGE
Supports ISO/IEC 7816-4 INS code ‘88’ for INTERNAL AUTHENTICATE
Supports ISO/IEC 7816-4 INS code ‘82’ for EXTERNAL AUTHENTICATE
2.3 Non-volatile memory
2 kB or 4 kB or 8 kB NV-Memory
Data retention of 10 years
Write endurance typcial 500 000 cycles
2.4 NV-memory organization
Flexible file system
Up to 28 applications simultaneously on one PICC
Up to 32 files in each application (standard data file, back-up data file, value file, linear
record file and cyclic record file)
File size is determined during creation
2.5 Security
MF3ICDX21_41_81_SDS
Common Criteria Certification: EAL4+ (Hardware and Software)
Unique 7 bytes serial number for each device
Optional “RANDOM” ID for enhance security and privacy
Mutual three pass authentication
Mutual authentication according to ISO/IEC 7816-4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 21 December 2010
145631
2 of 18
NXP Semiconductors
MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
1 card master key and up to 14 keys per application
Hardware DES using 56/112/168 bit keys featuring key version, data authenticity by
8 byte CMAC
Hardware AES using 128-bit keys featuring key version, data authenticity by 8 byte
CMAC
Data encryption on RF-channel
Authentication on application level
Hardware exception sensors
Self-securing file system
Backward compatibility to MF3ICD40: 4 byte MAC, CRC 16
2.6 Special features
Transaction oriented automatic anti-tear mechanism
Configurable ATS information for card personalisation
Backward compatibility mode to MF3ICD40
Optional high input capacitance (70pF) for small form factor design (MF3ICDH
21/41/81)
3. Applications
Advanced public transportation schema
Highly secure access management
Closed-loop e-payment scheme
Event ticketing
eGovernment applications
MF3ICDX21_41_81_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 21 December 2010
145631
3 of 18
NXP Semiconductors
MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
4. Quick reference data
Table 1.
Symbol
f
i
C
i
Quick reference data
[1][2]
Parameter
input frequency
input capacitance for
MF3ICD21/41/81
input capacitance for
MF3ICDH21/41/81
EEPROM characteristics
t
ret
N
endu(W)
t
cy(W)
[1]
[2]
[3]
Conditions
T
amb
= 22
C;
f
i
= 13.56 MHz;
2.8 V RMS
[3]
Min
-
14.96
64
Typ
13.56
17.0
69
Max
-
19.04
74
Unit
MHz
pF
pF
retention time
write endurance
write cycle time
T
amb
= 22
C
T
amb
= 22
C
T
amb
= 22
C
10
200000
-
-
500000
2.9
-
-
-
year
cycle
ms
Stresses above one or more of the values may cause permanent damage to the device.
Exposure to limiting values for extended periods may affect device reliability.
Measured with LCR meter.
5. Ordering information
Table 2.
Ordering information
Package
Name
MF3ICD8101DUD/05
FFC
Description
8 inch wafer (sawn; 120
m
thickness, on film frame carrier; electronic
fail die marking according to SECSII format); see
Ref. 4,
8K EEPROM, 17pF input capacitance
8 inch wafer (sawn; 120
m
thickness, on film frame carrier; electronic
fail die marking according to SECSII format); see
Ref. 4,
4K EEPROM, 17pF input capacitance
8 inch wafer (sawn; 120
m
thickness, on film frame carrier; electronic
fail die marking according to SECSII format); see
Ref. 4,
2K EEPROM, 17pF input capacitance
8 inch wafer (sawn; 120
m
thickness, on film frame carrier; electronic
fail die marking according to SECSII format); see
Ref. 5,
8K EEPROM, 70pF input capacitance
8 inch wafer (sawn; 120
m
thickness, on film frame carrier; electronic
fail die marking according to SECSII format); see
Ref. 5,
4K EEPROM, 70pF input capacitance
8 inch wafer (sawn; 120
m
thickness, on film frame carrier; electronic
fail die marking according to SECSII format); see
Ref. 5,
2K EEPROM, 70pF input capacitance
plastic leadless module carrier package; 35 mm wide tape; see
Ref. 6,
8K EEPROM, 17pF input capacitance
plastic leadless module carrier package; 35 mm wide tape; see
Ref. 6,
4K EEPROM, 17pF input capacitance
plastic leadless module carrier package; 35 mm wide tape; see
Ref. 6,
2K EEPROM, 17pF input capacitance
Version
-
Type number
MF3ICD4101DUD/05
FFC
-
MF3ICD2101DUD/05
FFC
-
MF3ICDH8101DUD/05
FFC
-
MF3ICDH4101DUD/05
FFC
-
MF3ICDH2101DUD/05
FFC
-
MF3MOD8101DA4/05
MF3MOD4101DA4/05
MF3MOD2101DA4/05
PLLMC
[1]
PLLMC
[1]
PLLMC
[1]
SOT500-2
SOT500-2
SOT500-2
MF3ICDX21_41_81_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 21 December 2010
145631
4 of 18
NXP Semiconductors
MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
Table 2.
Ordering information
…continued
Package
Name
Description
plastic leadless module carrier package; 35 mm wide tape; see
Ref. 6,
8K EEPROM, 70pF input capacitance
plastic leadless module carrier package; 35 mm wide tape; see
Ref. 6,
4K EEPROM, 70pF input capacitance
plastic leadless module carrier package; 35 mm wide tape; see
Ref. 6,
2K EEPROM, 70pF input capacitance
Version
SOT500-2
SOT500-2
SOT500-2
PLLMC
[1]
PLLMC
[1]
PLLMC
[1]
Type number
MF3MODH8101DA4/05
MF3MODH4101DA4/05
MF3MODH2101DA4/05
[1]
This package is also known as MOA4.
6. Block diagram
RF
INTERFACE
SECURITY
SENSORS
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
UART
ISO/IEC
14443A
CRYPTO
CO-PROCESSOR
TRUE RANDOM
NUMBER
GENERATOR
CPU
CRC
ROM
RAM
EEPROM
001aah878
Fig 1.
Block diagram of MF3ICD(H)81, MF3ICD(H)41, MF3ICD(H)21
MF3ICDX21_41_81_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 21 December 2010
145631
5 of 18
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