MC68LC060ZU75 datasheet, PDF - EEWORLD Datasheet

MC68LC060ZU75: DescriptionMicroprocessors - MPU 32B W/ CACHE MMU; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，417 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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Microprocessors - MPU 32B W/ CACHE MMU

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	BGA,
Contacts	304
Reach Compliance Code	not_compliant
ECCN code	3A991
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	75 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B304
JESD-609 code	e0
low power mode	YES
Humidity sensitivity level	3
Number of terminals	304
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	220
Certification status	Not Qualified
speed	75 MHz
Maximum supply voltage	3.465 V
Minimum supply voltage	3.135 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

	MC68LC060ZU75	MC68LC060ZU50	MC68LC060BRC66
Description	Microprocessors - MPU 32B W/ CACHE MMU	Microprocessors - MPU 32B W/ CACHE MMU	Microprocessors - MPU 32B W/ CACHE MMU
Is it Rohs certified?	incompatible	incompatible	conform to
Parts packaging code	BGA	BGA	PGA
package instruction	BGA,	BGA,	PGA,
Contacts	304	304	206
Reach Compliance Code	not_compliant	not_compliant	compliant
ECCN code	3A991	3A991	3A991
Address bus width	32	32	32
bit size	32	32	32
boundary scan	YES	YES	YES
maximum clock frequency	75 MHz	50 MHz	66.67 MHz
External data bus width	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES
JESD-30 code	S-PBGA-B304	S-PBGA-B304	S-CPGA-P206
low power mode	YES	YES	YES
Number of terminals	304	304	206
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA	BGA	PGA
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	220	220	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified
speed	75 MHz	50 MHz	66.67 MHz
Maximum supply voltage	3.465 V	3.465 V	3.465 V
Minimum supply voltage	3.135 V	3.135 V	3.135 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	PIN/PEG
Terminal location	BOTTOM	BOTTOM	PERPENDICULAR
Maximum time at peak reflow temperature	30	30	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Maker	NXP	-	NXP
JESD-609 code	e0	e0	-
Humidity sensitivity level	3	3	-
Terminal surface	TIN LEAD	TIN LEAD	-

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