MC68LC060BRC66 datasheet, PDF - EEWORLD Datasheet

MC68LC060BRC66: DescriptionMicroprocessors - MPU 32B W/ CACHE MMU; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，417 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

Download Datasheet Parametric Compare View All

MC68LC060BRC66 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	MC68LC060BRC66	-	-	View	Buy Now

Microprocessors - MPU 32B W/ CACHE MMU

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	PGA
package instruction	PGA,
Contacts	206
Reach Compliance Code	compliant
ECCN code	3A991
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	66.67 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-CPGA-P206
length	47.245 mm
low power mode	YES
Number of terminals	206
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	3.05 mm
speed	66.67 MHz
Maximum supply voltage	3.465 V
Minimum supply voltage	3.135 V
Nominal supply voltage	3.3 V
surface mount	NO
technology	CMOS
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	47.245 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

	MC68LC060BRC66	MC68LC060ZU50	MC68LC060ZU75
Description	Microprocessors - MPU 32B W/ CACHE MMU	Microprocessors - MPU 32B W/ CACHE MMU	Microprocessors - MPU 32B W/ CACHE MMU
Is it Rohs certified?	conform to	incompatible	incompatible
Parts packaging code	PGA	BGA	BGA
package instruction	PGA,	BGA,	BGA,
Contacts	206	304	304
Reach Compliance Code	compliant	not_compliant	not_compliant
ECCN code	3A991	3A991	3A991
Address bus width	32	32	32
bit size	32	32	32
boundary scan	YES	YES	YES
maximum clock frequency	66.67 MHz	50 MHz	75 MHz
External data bus width	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES
JESD-30 code	S-CPGA-P206	S-PBGA-B304	S-PBGA-B304
low power mode	YES	YES	YES
Number of terminals	206	304	304
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	PGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	220	220
Certification status	Not Qualified	Not Qualified	Not Qualified
speed	66.67 MHz	50 MHz	75 MHz
Maximum supply voltage	3.465 V	3.465 V	3.465 V
Minimum supply voltage	3.135 V	3.135 V	3.135 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V
surface mount	NO	YES	YES
technology	CMOS	CMOS	CMOS
Terminal form	PIN/PEG	BALL	BALL
Terminal location	PERPENDICULAR	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	30	30
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Maker	NXP	-	NXP
JESD-609 code	-	e0	e0
Humidity sensitivity level	-	3	3
Terminal surface	-	TIN LEAD	TIN LEAD

Circuit Design_Buzzer Tips: [size=4][color=rgb(51, 51, 51)][font=Helvetica,]Buzzers are divided into two categories: piezoelectric and electromagnetic. [/font][/color][color=#333333][/color][/size][color=rgb(51, 51, 51)][font=He...; fish001 Analogue and Mixed Signal

STTS751 High Accuracy Temperature Sensor Extension for MakeCode: This content is originally created by dcexpert, a user of EEWORLD forum . If you want to reprint or use it for commercial purposes, you must obtain the author’s consent and indicate the source....; dcexpert MEMS sensors

[Discussion]Embedded Website: Comprehensive website for embedded systems http://www.eg3.com (English)Rich product introductions and links (embedded field).http://www.embedded-directory.com (English)Introduction to embedded product...; sjjy Embedded System

Are the design formulas for a push-pull transformer correct?: [i=s]This post was last edited by Weilin Power Supply on 2019-8-13 14:21[/i]The design of push-pull transformer is divided into two design methods: AP method and KG method. Both design methods are bas...; 伟林电源 Power technology

The last episode of the second live broadcast of embedded processing theme month: flow meter based on TI MSP430 Scan Interface technology...: [size=4]Event details >> [url=https://www.eeworld.com.cn/huodong/TI_EP_month_Webinar_201806/][color=#0000ff]The second wave of embedded processing live theme month is coming[/color][/url] [/size] [siz...; EEWORLD社区 TI Technology Forum

Should Dead Copper Be Removed in PCB Design?: PCB dead copper, also known as PCB island, refers to isolated and unconnected copper foil in the PCB. It is usually produced when copper is laid. Should dead copper be removed in PCB design?　　Some peo...; 捷配pcb打样快 PCB Design

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components