Development Boards u0026 Kits - S08 / S12 9S08RG60 DEMO BOARD
| Parameter Name | Attribute value |
| Brand Name | Freescale |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | QFP |
| package instruction | LFQFP, QFP32,.28SQ,20 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| JESD-30 code | S-PQFP-G32 |
| JESD-609 code | e3 |
| length | 5 mm |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 32 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFQFP |
| Encapsulate equivalent code | QFP32,.28SQ,20 |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 40 |
| width | 5 mm |
| Base Number Matches | 1 |
| MC33596FJER2 | MC33596FCE | MC33596FJAER2 | |
|---|---|---|---|
| Description | Development Boards u0026 Kits - S08 / S12 9S08RG60 DEMO BOARD | Development Boards u0026 Kits - S08 / S12 9S08RG60 DEMO BOARD | Development Boards u0026 Kits - S08 / S12 9S08RG60 DEMO BOARD |
| Brand Name | Freescale | Freescale | Freescale |
| Is it lead-free? | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to |
| Parts packaging code | QFP | QFN | QFP |
| package instruction | LFQFP, QFP32,.28SQ,20 | HVQCCN, LCC32,.2SQ,20 | LFQFP, QFP32,.28SQ,20 |
| Contacts | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 |
| JESD-30 code | S-PQFP-G32 | S-XQCC-N32 | S-PQFP-G32 |
| length | 5 mm | 5 mm | 5 mm |
| Humidity sensitivity level | 3 | 3 | 3 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | LFQFP | HVQCCN | LFQFP |
| Encapsulate equivalent code | QFP32,.28SQ,20 | LCC32,.2SQ,20 | QFP32,.28SQ,20 |
| Package shape | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 |
| power supply | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 1 mm | 1.6 mm |
| Nominal supply voltage | 3 V | 3 V | 3 V |
| surface mount | YES | YES | YES |
| Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| Temperature level | INDUSTRIAL | INDUSTRIAL | OTHER |
| Terminal form | GULL WING | NO LEAD | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 40 | 40 | 40 |
| width | 5 mm | 5 mm | 5 mm |
| Base Number Matches | 1 | 1 | 1 |
| JESD-609 code | e3 | - | e3 |
| Terminal surface | Matte Tin (Sn) | - | Matte Tin (Sn) |
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