Audio Amplifiers
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | BGA |
| package instruction | 1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12 |
| Contacts | 12 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Nominal bandwidth | 22 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| Gain | 6 dB |
| JESD-30 code | R-PBGA-B12 |
| JESD-609 code | e0 |
| length | 2.02 mm |
| Humidity sensitivity level | 1 |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 12 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output power | 1.6 W |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA12,3X4,20 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 245 |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.67 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 1.54 mm |
| MAX9700AEBC-T | MAX9700CEUB- | MAX9700DEUB-T | MAX9700BEUB- | MAX9700CEUB | MAX9700DEUB | MAX9700AEUB- | MAX9700CEBC-T | |
|---|---|---|---|---|---|---|---|---|
| Description | Audio Amplifiers | Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp | Speakers u0026 Transducers 0.7W 8Ohm 480Hz 18x13 spring contact | Audio Amplifiers | Audio Amplifiers | Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp | Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp | |
| Is it lead-free? | Contains lead | - | Contains lead | - | Contains lead | Contains lead | - | Contains lead |
| Is it Rohs certified? | incompatible | - | incompatible | - | incompatible | incompatible | - | incompatible |
| Maker | Maxim | - | Maxim | - | Maxim | Maxim | - | Maxim |
| Parts packaging code | BGA | - | TSSOP | - | TSSOP | TSSOP | - | BGA |
| package instruction | 1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12 | - | MO-187CBA, MICRO, SOP-10 | - | MO-187CBA, MICRO, SOP-10 | MO-187CBA, MICRO, SOP-10 | - | 1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12 |
| Contacts | 12 | - | 10 | - | 10 | 10 | - | 12 |
| Reach Compliance Code | not_compliant | - | not_compliant | - | not_compliant | not_compliant | - | not_compliant |
| ECCN code | EAR99 | - | EAR99 | - | EAR99 | EAR99 | - | EAR99 |
| Nominal bandwidth | 22 kHz | - | 22 kHz | - | 22 kHz | 22 kHz | - | 22 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER |
| Gain | 6 dB | - | 20 dB | - | 15.6 dB | 20 dB | - | 15.6 dB |
| JESD-30 code | R-PBGA-B12 | - | S-PDSO-G10 | - | S-PDSO-G10 | S-PDSO-G10 | - | R-PBGA-B12 |
| JESD-609 code | e0 | - | e0 | - | e0 | e0 | - | e0 |
| length | 2.02 mm | - | 3 mm | - | 3 mm | 3 mm | - | 2.02 mm |
| Number of channels | 1 | - | 1 | - | 1 | 1 | - | 1 |
| Number of functions | 1 | - | 1 | - | 1 | 1 | - | 1 |
| Number of terminals | 12 | - | 10 | - | 10 | 10 | - | 12 |
| Maximum operating temperature | 85 °C | - | 85 °C | - | 85 °C | 85 °C | - | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
| Nominal output power | 1.6 W | - | 1.6 W | - | 1.6 W | 1.6 W | - | 1.6 W |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | VFBGA | - | TSSOP | - | TSSOP | TSSOP | - | VFBGA |
| Encapsulate equivalent code | BGA12,3X4,20 | - | TSSOP10,.19,20 | - | TSSOP10,.19,20 | TSSOP10,.19,20 | - | BGA12,3X4,20 |
| Package shape | RECTANGULAR | - | SQUARE | - | SQUARE | SQUARE | - | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 245 | - | 245 | - | 245 | 245 | - | 245 |
| power supply | 3.3/5 V | - | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | - | 3.3/5 V |
| Certification status | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| Maximum seat height | 0.67 mm | - | 1.1 mm | - | 1.1 mm | 1.1 mm | - | 0.67 mm |
| Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V | - | 2.5 V | - | 2.5 V | 2.5 V | - | 2.5 V |
| surface mount | YES | - | YES | - | YES | YES | - | YES |
| technology | BICMOS | - | BICMOS | - | BICMOS | BICMOS | - | BICMOS |
| Temperature level | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | BALL | - | GULL WING | - | GULL WING | GULL WING | - | BALL |
| Terminal pitch | 0.5 mm | - | 0.5 mm | - | 0.5 mm | 0.5 mm | - | 0.5 mm |
| Terminal location | BOTTOM | - | DUAL | - | DUAL | DUAL | - | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| width | 1.54 mm | - | 3 mm | - | 3 mm | 3 mm | - | 1.54 mm |
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