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MAX9700DEUB-T

CategoryAnalog mixed-signal IC    Consumption circuit   
File Size351KB,20 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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MAX9700DEUB-T Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeTSSOP
package instructionMO-187CBA, MICRO, SOP-10
Contacts10
Reach Compliance Codenot_compliant
ECCN codeEAR99
Nominal bandwidth22 kHz
Commercial integrated circuit typesAUDIO AMPLIFIER
Gain20 dB
JESD-30 codeS-PDSO-G10
JESD-609 codee0
length3 mm
Number of channels1
Number of functions1
Number of terminals10
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output power1.6 W
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP10,.19,20
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)245
power supply3.3/5 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3 mm

MAX9700DEUB-T Related Products

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Description Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp Speakers u0026 Transducers 0.7W 8Ohm 480Hz 18x13 spring contact Audio Amplifiers Audio Amplifiers Audio Amplifiers Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp
Is it lead-free? Contains lead - - Contains lead Contains lead Contains lead - Contains lead
Is it Rohs certified? incompatible - - incompatible incompatible incompatible - incompatible
Maker Maxim - - Maxim Maxim Maxim - Maxim
Parts packaging code TSSOP - - TSSOP BGA TSSOP - BGA
package instruction MO-187CBA, MICRO, SOP-10 - - MO-187CBA, MICRO, SOP-10 1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12 MO-187CBA, MICRO, SOP-10 - 1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12
Contacts 10 - - 10 12 10 - 12
Reach Compliance Code not_compliant - - not_compliant not_compliant not_compliant - not_compliant
ECCN code EAR99 - - EAR99 EAR99 EAR99 - EAR99
Nominal bandwidth 22 kHz - - 22 kHz 22 kHz 22 kHz - 22 kHz
Commercial integrated circuit types AUDIO AMPLIFIER - - AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER - AUDIO AMPLIFIER
Gain 20 dB - - 15.6 dB 6 dB 20 dB - 15.6 dB
JESD-30 code S-PDSO-G10 - - S-PDSO-G10 R-PBGA-B12 S-PDSO-G10 - R-PBGA-B12
JESD-609 code e0 - - e0 e0 e0 - e0
length 3 mm - - 3 mm 2.02 mm 3 mm - 2.02 mm
Number of channels 1 - - 1 1 1 - 1
Number of functions 1 - - 1 1 1 - 1
Number of terminals 10 - - 10 12 10 - 12
Maximum operating temperature 85 °C - - 85 °C 85 °C 85 °C - 85 °C
Minimum operating temperature -40 °C - - -40 °C -40 °C -40 °C - -40 °C
Nominal output power 1.6 W - - 1.6 W 1.6 W 1.6 W - 1.6 W
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code TSSOP - - TSSOP VFBGA TSSOP - VFBGA
Encapsulate equivalent code TSSOP10,.19,20 - - TSSOP10,.19,20 BGA12,3X4,20 TSSOP10,.19,20 - BGA12,3X4,20
Package shape SQUARE - - SQUARE RECTANGULAR SQUARE - RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 245 - - 245 245 245 - 245
power supply 3.3/5 V - - 3.3/5 V 3.3/5 V 3.3/5 V - 3.3/5 V
Certification status Not Qualified - - Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height 1.1 mm - - 1.1 mm 0.67 mm 1.1 mm - 0.67 mm
Maximum supply voltage (Vsup) 5.5 V - - 5.5 V 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 2.5 V - - 2.5 V 2.5 V 2.5 V - 2.5 V
surface mount YES - - YES YES YES - YES
technology BICMOS - - BICMOS BICMOS BICMOS - BICMOS
Temperature level INDUSTRIAL - - INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form GULL WING - - GULL WING BALL GULL WING - BALL
Terminal pitch 0.5 mm - - 0.5 mm 0.5 mm 0.5 mm - 0.5 mm
Terminal location DUAL - - DUAL BOTTOM DUAL - BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width 3 mm - - 3 mm 1.54 mm 3 mm - 1.54 mm
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