|
MAX9700DEUB-T |
MAX9700CEUB- |
MAX9700BEUB- |
MAX9700CEUB |
MAX9700AEBC-T |
MAX9700DEUB |
MAX9700AEUB- |
MAX9700CEBC-T |
Description |
|
Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp |
Speakers u0026 Transducers 0.7W 8Ohm 480Hz 18x13 spring contact |
Audio Amplifiers |
Audio Amplifiers |
Audio Amplifiers |
Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp |
Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp |
Is it lead-free? |
Contains lead |
- |
- |
Contains lead |
Contains lead |
Contains lead |
- |
Contains lead |
Is it Rohs certified? |
incompatible |
- |
- |
incompatible |
incompatible |
incompatible |
- |
incompatible |
Maker |
Maxim |
- |
- |
Maxim |
Maxim |
Maxim |
- |
Maxim |
Parts packaging code |
TSSOP |
- |
- |
TSSOP |
BGA |
TSSOP |
- |
BGA |
package instruction |
MO-187CBA, MICRO, SOP-10 |
- |
- |
MO-187CBA, MICRO, SOP-10 |
1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12 |
MO-187CBA, MICRO, SOP-10 |
- |
1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12 |
Contacts |
10 |
- |
- |
10 |
12 |
10 |
- |
12 |
Reach Compliance Code |
not_compliant |
- |
- |
not_compliant |
not_compliant |
not_compliant |
- |
not_compliant |
ECCN code |
EAR99 |
- |
- |
EAR99 |
EAR99 |
EAR99 |
- |
EAR99 |
Nominal bandwidth |
22 kHz |
- |
- |
22 kHz |
22 kHz |
22 kHz |
- |
22 kHz |
Commercial integrated circuit types |
AUDIO AMPLIFIER |
- |
- |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
- |
AUDIO AMPLIFIER |
Gain |
20 dB |
- |
- |
15.6 dB |
6 dB |
20 dB |
- |
15.6 dB |
JESD-30 code |
S-PDSO-G10 |
- |
- |
S-PDSO-G10 |
R-PBGA-B12 |
S-PDSO-G10 |
- |
R-PBGA-B12 |
JESD-609 code |
e0 |
- |
- |
e0 |
e0 |
e0 |
- |
e0 |
length |
3 mm |
- |
- |
3 mm |
2.02 mm |
3 mm |
- |
2.02 mm |
Number of channels |
1 |
- |
- |
1 |
1 |
1 |
- |
1 |
Number of functions |
1 |
- |
- |
1 |
1 |
1 |
- |
1 |
Number of terminals |
10 |
- |
- |
10 |
12 |
10 |
- |
12 |
Maximum operating temperature |
85 °C |
- |
- |
85 °C |
85 °C |
85 °C |
- |
85 °C |
Minimum operating temperature |
-40 °C |
- |
- |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
Nominal output power |
1.6 W |
- |
- |
1.6 W |
1.6 W |
1.6 W |
- |
1.6 W |
Package body material |
PLASTIC/EPOXY |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
- |
- |
TSSOP |
VFBGA |
TSSOP |
- |
VFBGA |
Encapsulate equivalent code |
TSSOP10,.19,20 |
- |
- |
TSSOP10,.19,20 |
BGA12,3X4,20 |
TSSOP10,.19,20 |
- |
BGA12,3X4,20 |
Package shape |
SQUARE |
- |
- |
SQUARE |
RECTANGULAR |
SQUARE |
- |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
245 |
- |
- |
245 |
245 |
245 |
- |
245 |
power supply |
3.3/5 V |
- |
- |
3.3/5 V |
3.3/5 V |
3.3/5 V |
- |
3.3/5 V |
Certification status |
Not Qualified |
- |
- |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Maximum seat height |
1.1 mm |
- |
- |
1.1 mm |
0.67 mm |
1.1 mm |
- |
0.67 mm |
Maximum supply voltage (Vsup) |
5.5 V |
- |
- |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
Minimum supply voltage (Vsup) |
2.5 V |
- |
- |
2.5 V |
2.5 V |
2.5 V |
- |
2.5 V |
surface mount |
YES |
- |
- |
YES |
YES |
YES |
- |
YES |
technology |
BICMOS |
- |
- |
BICMOS |
BICMOS |
BICMOS |
- |
BICMOS |
Temperature level |
INDUSTRIAL |
- |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
- |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
- |
- |
GULL WING |
BALL |
GULL WING |
- |
BALL |
Terminal pitch |
0.5 mm |
- |
- |
0.5 mm |
0.5 mm |
0.5 mm |
- |
0.5 mm |
Terminal location |
DUAL |
- |
- |
DUAL |
BOTTOM |
DUAL |
- |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
width |
3 mm |
- |
- |
3 mm |
1.54 mm |
3 mm |
- |
1.54 mm |