FPGA - Field Programmable Gate Array CPLD - APEX 20K 416 Macro 252 IOs
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | BGA |
package instruction | FINE LINE, BGA-324 |
Contacts | 324 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991 |
Is Samacsys | N |
JESD-30 code | S-PBGA-B324 |
JESD-609 code | e0 |
length | 19 mm |
Humidity sensitivity level | 3 |
Dedicated input times | 4 |
Number of I/O lines | 252 |
Number of entries | 246 |
Number of logical units | 4160 |
Output times | 246 |
Number of terminals | 324 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 4 DEDICATED INPUTS, 252 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA324(UNSPEC) |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 2.5,2.5/3.3 V |
Programmable logic type | LOADABLE PLD |
propagation delay | 3.6 ns |
Certification status | Not Qualified |
Maximum seat height | 3.5 mm |
Maximum supply voltage | 2.625 V |
Minimum supply voltage | 2.375 V |
Nominal supply voltage | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 19 mm |
Base Number Matches | 1 |