IS42S16400D-7BL datasheet, PDF

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IS42S16400D-7BL: DescriptionDRAM 64M 4Mx16 143Mhz; Categorystorage storage; File Size618KB，57 Pages; ManufacturerISSI(Integrated Silicon Solution Inc.); Websitehttp://www.issi.com/; Environmental Compliance

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IS42S16400D-7BL Overview

DRAM 64M 4Mx16 143Mhz

IS42S16400D-7BL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ISSI(Integrated Silicon Solution Inc.)
Parts packaging code	BGA
package instruction	TFBGA, BGA60,7X15,25
Contacts	60
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	7 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	143 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PBGA-B60
JESD-609 code	e1
length	10.1 mm
memory density	67108864 bit
Memory IC Type	SYNCHRONOUS DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	60
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA60,7X15,25
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.001 A
Maximum slew rate	0.13 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	6.4 mm
Base Number Matches	1

IS42S16400D-7BL Related Products

	IS42S16400D-7BL	IS42S16400D-6T	IS42S16400D-6BL-TR	IS42S16400D-7TL	IS42S16400D-7TLI	IS42S16400D-7TI-TR	IS42S16400D-6TL-TR
Description	DRAM 64M 4Mx16 143Mhz	DRAM 64M 4Mx16 166Mhz	DRAM 64M 4Mx16 166Mhz	DRAM 64M 4Mx16 143Mhz	DRAM 64M 4Mx16 143Mhz Industrial Temp	DRAM 64M 4Mx16 143Mhz Industrial Temp	DRAM 64M 4Mx16 166Mhz
Is it Rohs certified?	conform to	incompatible	-	conform to	conform to	-	conform to
Maker	ISSI(Integrated Silicon Solution Inc.)	ISSI(Integrated Silicon Solution Inc.)	-	ISSI(Integrated Silicon Solution Inc.)	ISSI(Integrated Silicon Solution Inc.)	-	-
Parts packaging code	BGA	TSOP2	-	TSOP2	TSOP2	-	TSOP2
package instruction	TFBGA, BGA60,7X15,25	TSOP2, TSOP54,.46,32	-	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	-	TSOP2,
Contacts	60	54	-	54	54	-	54
Reach Compliance Code	compliant	not_compliant	-	compliant	compliant	-	unknown
ECCN code	EAR99	EAR99	-	EAR99	EAR99	-	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST
Maximum access time	7 ns	6 ns	-	7 ns	7 ns	-	6 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	143 MHz	166 MHz	-	143 MHz	143 MHz	-	-
I/O type	COMMON	COMMON	-	COMMON	COMMON	-	-
interleaved burst length	1,2,4,8	1,2,4,8	-	1,2,4,8	1,2,4,8	-	-
JESD-30 code	R-PBGA-B60	R-PDSO-G54	-	R-PDSO-G54	R-PDSO-G54	-	R-PDSO-G54
JESD-609 code	e1	e0	-	e3	e3	-	e3
length	10.1 mm	22.22 mm	-	22.22 mm	22.22 mm	-	22.22 mm
memory density	67108864 bit	67108864 bit	-	67108864 bit	67108864 bit	-	67108864 bit
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	-	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	-	SYNCHRONOUS DRAM
memory width	16	16	-	16	16	-	16
Number of functions	1	1	-	1	1	-	1
Number of ports	1	1	-	1	1	-	1
Number of terminals	60	54	-	54	54	-	54
word count	4194304 words	4194304 words	-	4194304 words	4194304 words	-	4194304 words
character code	4000000	4000000	-	4000000	4000000	-	4000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	-	70 °C	85 °C	-	70 °C
organize	4MX16	4MX16	-	4MX16	4MX16	-	4MX16
Output characteristics	3-STATE	3-STATE	-	3-STATE	3-STATE	-	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	TFBGA	TSOP2	-	TSOP2	TSOP2	-	TSOP2
Encapsulate equivalent code	BGA60,7X15,25	TSOP54,.46,32	-	TSOP54,.46,32	TSOP54,.46,32	-	-
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	260
power supply	3.3 V	3.3 V	-	3.3 V	3.3 V	-	-
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified
refresh cycle	4096	4096	-	4096	4096	-	-
Maximum seat height	1.2 mm	1.2 mm	-	1.2 mm	1.2 mm	-	1.2 mm
self refresh	YES	YES	-	YES	YES	-	YES
Continuous burst length	1,2,4,8,FP	1,2,4,8,FP	-	1,2,4,8,FP	1,2,4,8,FP	-	-
Maximum standby current	0.001 A	0.001 A	-	0.001 A	0.003 A	-	-
Maximum slew rate	0.13 mA	0.15 mA	-	0.13 mA	0.15 mA	-	-
Maximum supply voltage (Vsup)	3.6 V	3.6 V	-	3.6 V	3.6 V	-	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	-	3 V	3 V	-	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	-	3.3 V	3.3 V	-	3.3 V
surface mount	YES	YES	-	YES	YES	-	YES
technology	CMOS	CMOS	-	CMOS	CMOS	-	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	INDUSTRIAL	-	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)	-	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	-	Matte Tin (Sn)
Terminal form	BALL	GULL WING	-	GULL WING	GULL WING	-	GULL WING
Terminal pitch	0.65 mm	0.8 mm	-	0.8 mm	0.8 mm	-	0.8 mm
Terminal location	BOTTOM	DUAL	-	DUAL	DUAL	-	DUAL
Maximum time at peak reflow temperature	40	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	40
width	6.4 mm	10.16 mm	-	10.16 mm	10.16 mm	-	10.16 mm

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