|
KIT33882EKEVB |
MC33882PEPR2 |
MC33882PEP |
MC33882VWR2 |
MC33882PEKR2 |
|
Description |
Development Boards u0026 Kits - ARM Kinetis-L Series Freedom Board |
Power Switch ICs - Power Distribution SIX OUTPUT LOW SIDE SW |
Linear Voltage Regulators 5V 1A Positive |
Power Switch ICs - Power Distribution SIX-OUTPUT LSS/SPI PARAL |
Power Switch ICs - Power Distribution Driver Low side Six Output Switch |
|
Is it lead-free? |
- |
Lead free |
Lead free |
- |
Lead free |
|
Is it Rohs certified? |
- |
conform to |
conform to |
conform to |
conform to |
|
Maker |
- |
NXP |
NXP |
NXP |
NXP |
|
Parts packaging code |
- |
QFN |
QFN |
SOIC |
- |
|
package instruction |
- |
7 X 7 MM, 1 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, MO-220VKKC, QFN-32 |
7 X 7 MM, 1 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, MO-220VKKC, QFN-32 |
LEAD FREE, PLASTIC, HSOP-30 |
- |
|
Contacts |
- |
32 |
32 |
30 |
- |
|
Reach Compliance Code |
- |
unknown |
unknown |
not_compliant |
compliant |
|
ECCN code |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
|
Built-in protection |
- |
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE; TRANSIENT |
- |
|
Number of drives |
- |
8 |
8 |
- |
8 |
|
Interface integrated circuit type |
- |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
|
JESD-30 code |
- |
S-XQCC-N32 |
S-XQCC-N32 |
R-PDSO-G30 |
R-PDSO-G32 |
|
JESD-609 code |
- |
e3 |
e3 |
- |
e3 |
|
length |
- |
7 mm |
7 mm |
15.9 mm |
- |
|
Humidity sensitivity level |
- |
3 |
3 |
3 |
3 |
|
Number of functions |
- |
1 |
1 |
1 |
- |
|
Number of terminals |
- |
32 |
32 |
30 |
32 |
|
Maximum operating temperature |
- |
125 °C |
125 °C |
125 °C |
125 °C |
|
Minimum operating temperature |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
|
Output current flow direction |
- |
SINK |
SINK |
SINK |
- |
|
Nominal output peak current |
- |
3 A |
3 A |
1 A |
- |
|
Package body material |
- |
UNSPECIFIED |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
|
encapsulated code |
- |
HVQCCN |
HVQCCN |
HSSOP |
SSOP |
|
Encapsulate equivalent code |
- |
LCC32,.27SQ,25 |
LCC32,.27SQ,25 |
- |
SSOP32,.4 |
|
Package shape |
- |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
|
Package form |
- |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
|
Peak Reflow Temperature (Celsius) |
- |
260 |
260 |
245 |
260 |
|
power supply |
- |
5,9/17 V |
5,9/17 V |
- |
5,9/17 V |
|
Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
|
Maximum seat height |
- |
1 mm |
1 mm |
3.404 mm |
- |
|
Maximum supply voltage |
- |
5.5 V |
5.5 V |
5.25 V |
- |
|
Minimum supply voltage |
- |
4.5 V |
4.5 V |
4.75 V |
- |
|
Nominal supply voltage |
- |
5 V |
5 V |
5 V |
- |
|
Supply voltage 1-max |
- |
25 V |
25 V |
25 V |
- |
|
Mains voltage 1-minute |
- |
8 V |
8 V |
8 V |
- |
|
Supply voltage1-Nom |
- |
13 V |
13 V |
13 V |
- |
|
surface mount |
- |
YES |
YES |
YES |
YES |
|
technology |
- |
MOS |
MOS |
BCDMOS |
BICMOS |
|
Temperature level |
- |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
|
Terminal surface |
- |
Matte Tin (Sn) |
Matte Tin (Sn) |
- |
Matte Tin (Sn) |
|
Terminal form |
- |
NO LEAD |
NO LEAD |
GULL WING |
GULL WING |
|
Terminal pitch |
- |
0.65 mm |
0.65 mm |
0.8 mm |
0.635 mm |
|
Terminal location |
- |
QUAD |
QUAD |
DUAL |
DUAL |
|
Maximum time at peak reflow temperature |
- |
40 |
40 |
30 |
40 |
|
Disconnect time |
- |
10 µs |
10 µs |
10 µs |
- |
|
connection time |
- |
10 µs |
10 µs |
10 µs |
- |
|
width |
- |
7 mm |
7 mm |
11 mm |
- |
|
Base Number Matches |
- |
1 |
1 |
1 |
1 |
|