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KIT33882EKEVB

Description
Development Boards u0026 Kits - ARM Kinetis-L Series Freedom Board
CategoryDevelopment board/suite/development tools   
File Size1MB,24 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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KIT33882EKEVB Overview

Development Boards u0026 Kits - ARM Kinetis-L Series Freedom Board

KIT33882EKEVB Parametric

Parameter NameAttribute value
Product CategorySwitch IC Development Tools
ManufacturerNXP
RoHSDetails
TypeAnalog Switches
PackagingBulk
Maximum Operating Temperature+ 150 C
Minimum Operating Temperature- 40 C
Operating Supply Voltage4.5 V to 8 V
Factory Pack Quantity1
Unit Weight1 lb

KIT33882EKEVB Related Products

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Description Development Boards u0026 Kits - ARM Kinetis-L Series Freedom Board Power Switch ICs - Power Distribution SIX OUTPUT LOW SIDE SW Linear Voltage Regulators 5V 1A Positive Power Switch ICs - Power Distribution SIX-OUTPUT LSS/SPI PARAL Power Switch ICs - Power Distribution Driver Low side Six Output Switch
Is it lead-free? - Lead free Lead free - Lead free
Is it Rohs certified? - conform to conform to conform to conform to
Maker - NXP NXP NXP NXP
Parts packaging code - QFN QFN SOIC -
package instruction - 7 X 7 MM, 1 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, MO-220VKKC, QFN-32 7 X 7 MM, 1 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, MO-220VKKC, QFN-32 LEAD FREE, PLASTIC, HSOP-30 -
Contacts - 32 32 30 -
Reach Compliance Code - unknown unknown not_compliant compliant
ECCN code - EAR99 EAR99 EAR99 EAR99
Built-in protection - TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE; TRANSIENT -
Number of drives - 8 8 - 8
Interface integrated circuit type - BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code - S-XQCC-N32 S-XQCC-N32 R-PDSO-G30 R-PDSO-G32
JESD-609 code - e3 e3 - e3
length - 7 mm 7 mm 15.9 mm -
Humidity sensitivity level - 3 3 3 3
Number of functions - 1 1 1 -
Number of terminals - 32 32 30 32
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Output current flow direction - SINK SINK SINK -
Nominal output peak current - 3 A 3 A 1 A -
Package body material - UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - HVQCCN HVQCCN HSSOP SSOP
Encapsulate equivalent code - LCC32,.27SQ,25 LCC32,.27SQ,25 - SSOP32,.4
Package shape - SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - 260 260 245 260
power supply - 5,9/17 V 5,9/17 V - 5,9/17 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1 mm 1 mm 3.404 mm -
Maximum supply voltage - 5.5 V 5.5 V 5.25 V -
Minimum supply voltage - 4.5 V 4.5 V 4.75 V -
Nominal supply voltage - 5 V 5 V 5 V -
Supply voltage 1-max - 25 V 25 V 25 V -
Mains voltage 1-minute - 8 V 8 V 8 V -
Supply voltage1-Nom - 13 V 13 V 13 V -
surface mount - YES YES YES YES
technology - MOS MOS BCDMOS BICMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn)
Terminal form - NO LEAD NO LEAD GULL WING GULL WING
Terminal pitch - 0.65 mm 0.65 mm 0.8 mm 0.635 mm
Terminal location - QUAD QUAD DUAL DUAL
Maximum time at peak reflow temperature - 40 40 30 40
Disconnect time - 10 µs 10 µs 10 µs -
connection time - 10 µs 10 µs 10 µs -
width - 7 mm 7 mm 11 mm -
Base Number Matches - 1 1 1 1
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