Interface Circuit
| Parameter Name | Attribute value |
| package instruction | , |
| Reach Compliance Code | unknown |
| Base Number Matches | 1 |
| ES/EMY1401VI | ESY1401VI | EMY1401VI | |
|---|---|---|---|
| Description | Interface Circuit | Telecom Circuit, 1-Func, CDSO16, 6.4 X 5.6 MM HERMETIC SEALED, CERAMIC PACKAGE, 16 PIN | Telecom Circuit, 1-Func, CDSO16, 6.4 X 5.6 MM HERMETIC SEALED, CERAMIC PACKAGE, 16 PIN |
| package instruction | , | HSOF, | HSOF, |
| Reach Compliance Code | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 |
| Parts packaging code | - | SOIC | SOIC |
| Contacts | - | 16 | 16 |
| JESD-30 code | - | R-CDSO-F16 | R-CDSO-F16 |
| length | - | 5.6 mm | 5.6 mm |
| Negative supply voltage rating | - | -5.2 V | -5.2 V |
| Number of functions | - | 1 | 1 |
| Number of terminals | - | 16 | 16 |
| Maximum operating temperature | - | 75 °C | 75 °C |
| Package body material | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | - | HSOF | HSOF |
| Package shape | - | RECTANGULAR | RECTANGULAR |
| Package form | - | SMALL OUTLINE, HEAT SINK/SLUG | SMALL OUTLINE, HEAT SINK/SLUG |
| Certification status | - | Not Qualified | Not Qualified |
| Maximum seat height | - | 1.2 mm | 1.2 mm |
| surface mount | - | YES | YES |
| Telecom integrated circuit types | - | TELECOM CIRCUIT | TELECOM CIRCUIT |
| Temperature level | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| Terminal form | - | FLAT | FLAT |
| Terminal pitch | - | 0.65 mm | 0.65 mm |
| Terminal location | - | DUAL | DUAL |
| width | - | 5 mm | 5 mm |
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