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SQ7414AEN-T1-GE3

Description
MOSFET N-Channel 60V Automotive MOSFET
CategoryDiscrete semiconductor    The transistor   
File Size642KB,15 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
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SQ7414AEN-T1-GE3 Overview

MOSFET N-Channel 60V Automotive MOSFET

SQ7414AEN-T1-GE3 Parametric

Parameter NameAttribute value
MakerVishay
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
SQ7414AEN
www.vishay.com
Vishay Siliconix
Automotive N-Channel 60 V (D-S) 175 °C MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
(Ω) at V
GS
= 10 V
R
DS(on)
(Ω) at V
GS
= 4.5 V
I
D
(A)
Configuration
Package
60
0.026
0.036
16
Single
PowerPAK 1212-8
PowerPAK
®
1212-8
Single
D
D 8
D 7
D 6
5
FEATURES
• TrenchFET
®
power MOSFET
• Low thermal resistance PowerPAK
®
1212-8
package with 1.07 mm profile
• PWM optimized
• 100 % R
g
and UIS tested
• AEC-Q101 qualified
• Material categorization: for definitions of
compliance please see
www.vishay.com/doc?99912
D
G
3.
3
1
2
S
3
S
4
S
G
Bottom View
m
m
1
Top View
mm
.3
3
N-Channel MOSFET
S
Marking Code:
Q013
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
a
Continuous Source Current (Diode
Pulsed Drain Current
b
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d, e
L = 0.1 mH
T
C
= 25 °C
T
C
= 125 °C
Conduction)
a
T
C
= 25 °C
T
C
= 125 °C
SYMBOL
V
DS
V
GS
I
D
I
S
I
DM
I
AS
E
AS
P
D
T
J
, T
stg
LIMIT
60
± 20
16
16
16
72
18
16
62
20
-55 to +175
260
mJ
W
°C
A
UNIT
V
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mount
c
SYMBOL
R
thJA
R
thJC
LIMIT
81
2.4
UNIT
°C/W
Notes
a. Package limited.
b. Pulse test; pulse width
300 μs, duty cycle
2 %.
c. When mounted on 1" square PCB (FR4 material).
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S15-1878-Rev. C, 17-Aug-15
Document Number: 67050
1
For technical questions, contact:
automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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