Industrial Temperature Rating
-40° to +85° C
Broad Certifications with Multiple Antennas
FCC (USA), IC (Canada), ETSI (Europe),
Giteki (Japan), and RCM (AU/NZ)
On-Module Chip Antenna Available
Offers greater resistance to de-tuning vs. trace
or standard chip antennas
assembly
Larger pin outs simplify manufacturing
Sterling-LWB™
2.4 GHz Wi-Fi® and Bluetooth®
Multi-Standard Module
FEATURES AND BENEFITS
Actual Size (15.5 mm x 21 mm)
Delivers IEEE 802.11 b/g/n, BT v4.2 BR/EDR/LE wireless
connectivity
Based on next-generation silicon from Cypress
(CYW4343W)
Three versions of the module available:
SiP without antenna (10 mm x 10 mm x 1.2 mm)
With chip antenna (15.5 mm x 21 mm x 2 mm)
With external U.FL antenna port
(15.5 mm x 21 mm x 2 mm)
Latest Linux and Android drivers supported
directly by LSR
NEW:
Sterling-LWB for WICED
TM
reference
platform available for embedded MCU applications
SIG certified Bluetooth driver (QDID: 64781)
Multiple certified 2.4 GHz antenna options
Chip, Dipole, FlexPIFA™, mFlexPIFA™ & FlexNotch™
LSR offers in-house certification of additional
antennas at little to no cost
Enhanced collaborative co-existence algorithms
Nearly 60% lower Active Rx Power Consumption
(vs TiWi-BLE)
Practical Applications:
Security & Building Automation, Internet of
Things / M2M Connectivity, Smart Gateways
www.lsr.com | 262.375.4400
STERLING-LWB MODULE PERFORMANCE
SPECIFICATION
Operating Temp
Operating Voltage
WLAN Transmit
Power
WLAN Rx Sensitivity
VALUE
-40 to +85° C
3.0 V to 3.6 V
802.11b, 11 Mbps CCK: 17.5 dBm
802.11g, 54 Mbps rate: 14.0 dBm
802.11n, 65 Mbps MCS7: 12.5 dBm
802.11b, 11 Mbps CCK: -88 dBm
802.11g, 54 Mbps rate: -75 dBm
802.11n, 65 Mbps MCS7: -72 dBm
8.5 dBm (GFSK)
-90 dBm (GFSK)
Bluetooth Transmit
Power
Bluetooth Rx
Sensitivity
All specifications are preliminary and subject to change.
ORDER INFORMATION
PART
NUMBER
450-0152
450-0148
450-0159
450-0155
450-0156
450-0173
DESCRIPTION
Sterling-LWB Chip Antenna Module
Sterling-LWB U.FL Module
Sterling-LWB Base Module (SiP)
Sterling-LWB Development Board w/ U.FL
Sterling-LWB Development Board w/ Chip Antenna
Sterling-LWB for WICED
TM
Carrier Board
Dev Board with SD card form factor (Part # 450-0155
& 450-0156) for simple connectivity w/ NXP i.MX 6
and other platforms
LSR is the leader in Wireless Product Development, offering true
end-to-end solutions through its array of services and technical expertise.
Design Services
LSR delivers complete system solu-
tions from concept to manufacturing.
We are your wireless M2M solutions
partner, providing complete turnkey
services and solutions.
EMC Testing &
Certification
At LSR, we understand it is critical for
your company to have a compliant
product supported by the appropriate
documentation, ready for deployment
into the market. LSR provides the
experience and knowledge to provide
quality test services that meet your
timeline and budget.
Wireless Products
LSR offers the fastest, lowest cost
way to add wireless capabilities
to your product concept. LSR’s
fully-certified modules and anten-
nas accelerate your time-to-mar-
ket and support the full breadth
of communication technologies,
including:
RF Design/Engineering
Software/Firmware Design
Antenna Design
Industrial Design
Mechanical Engineering
On-Site FCC / IC /CE EMC
Certification
Wireless & Antenna Testing
EMC Testing
International Testing Services
Wi-Fi
®
Bluetooth
®
802.15.4 & proprietary protocols
Sterling-LWB NB_v2_3
Copyright © 2017 LS Research, LLC. All Rights Reserved. All registered trademarks or trademarks are property of their respective owners.
www.lsr.com | 262.375.4400
HARNESS THE STERLING-LWB
TM
FOR EMBEDDED
WI-FI® AND BLUETOOTH® LOW ENERGY APPLICATIONS
Introducing the
STERLING-LWB for WICED
TM
Reference Platform
You can now leverage the high-performance Sterling-LWB™
module for embedded MCU applications as well! The Sterling-
LWB for WICED
TM
reference platform provides a very simple
and fast way to add both Wi-Fi and BLE v4.2 connectivity
to your microcontroller-based design utilizing the power of
Cypress’ robust WICED
TM
software development kit. The low
cost, pre-certified Sterling-LWB is now validated with the
STM32F411 MCU and can be migrated to other popular MCU’s,
giving you unmatched speed in adding Wi-Fi and BLE to your
application. This comprehensive reference platform features
a carrier board for easy connectivity with the STM32F411
Discovery Kit, extensive documentation and software
examples, TiWiConnect™ cloud connectivity and ModuleLink™
mobile app for easy development and integration.
Sterling-LWB for WICED
TM
Carrier Board (450-0173)
Utilize the Popular WICED
TM
SDK by Cypress
Accelerate your WICED
TM
application
development with extensive software
examples and source code, including BLE
profiles, BLE for Wi-Fi commissioning,
Power Management, and more.
ModuleLink
TM
Mobile App for
Easy Evaluation
The ModuleLink
TM
Mobile App for
Android lets you connect immediately to
the Sterling-LWB from your mobile for
easy evaluation and testing.
Cloud-Ready with LSR’s
TiWiConnect
TM
With a free TiWiConnect
TM
developer
account and web portal, you can
quickly demonstrate full Wi-Fi-to-Cloud
functionality.
Take advantage of the platform’s
many Wi-Fi-to-Cloud sample
applications, including:
3-AXIS GYROSCOPE AND
ACCELEROMETER
LED CONTROL AND
STATUS
Sterling-LWB for WICED
TM
Carrier Board Block Diagram
Copyright © 2016 LS Research, LLC. All Rights Reserved. All registered trademarks or trademarks are property of their respective owners.
www.lsr.com | 262.375.4400
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