Part Number |
XC6SLX150-2FGG484I |
XC6SLX150-2FGG484C |
Description |
IC fpga 338 I/O 484fbga |
IC fpga 338 I/O 484fbga |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Parts packaging code |
BGA |
BGA |
package instruction |
23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 |
BGA, BGA484,22X22,40 |
Contacts |
484 |
484 |
Reach Compliance Code |
compliant |
compliant |
ECCN code |
3A991.D |
3A991.D |
Factory Lead Time |
12 weeks |
12 weeks |
maximum clock frequency |
667 MHz |
667 MHz |
Combined latency of CLB-Max |
0.26 ns |
0.26 ns |
JESD-30 code |
S-PBGA-B484 |
S-PBGA-B484 |
JESD-609 code |
e1 |
e1 |
length |
23 mm |
23 mm |
Humidity sensitivity level |
3 |
3 |
Configurable number of logic blocks |
11519 |
11519 |
Number of entries |
338 |
338 |
Number of logical units |
147443 |
147443 |
Output times |
338 |
338 |
Number of terminals |
484 |
484 |
Maximum operating temperature |
100 °C |
85 °C |
organize |
11519 CLBS |
11519 CLBS |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
Encapsulate equivalent code |
BGA484,22X22,40 |
BGA484,22X22,40 |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
250 |
250 |
power supply |
1.2,2.5/3.3 V |
1.2,2.5/3.3 V |
Programmable logic type |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
2.6 mm |
2.6 mm |
Maximum supply voltage |
1.26 V |
1.26 V |
Minimum supply voltage |
1.14 V |
1.14 V |
Nominal supply voltage |
1.2 V |
1.2 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
OTHER |
Terminal surface |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form |
BALL |
BALL |
Terminal pitch |
1 mm |
1 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
30 |
30 |
width |
23 mm |
23 mm |
Base Number Matches |
1 |
1 |