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XC3S200A-4FT256

Showing 2 Results for XC3S200A-4FT256, including XC3S200A-4FT256C,XC3S200A-4FT256I, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
XC3S200A-4FT256C XILINX IC fpga 195 I/O 256ftbga Download
XC3S200A-4FT256I XILINX IC fpga 195 I/O 256ftbga Download
XC3S200A-4FT256 Related Product Datasheets:
Part Number Datasheet
XC3S200A-4FT256C 、 XC3S200A-4FT256I Download Datasheet
XC3S200A-4FT256 Related Products:
Part Number XC3S200A-4FT256I XC3S200A-4FT256C
Description IC fpga 195 I/O 256ftbga IC fpga 195 I/O 256ftbga
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker XILINX XILINX
Parts packaging code BGA BGA
package instruction LBGA, BGA256,16X16,40 FTBGA-256
Contacts 256 256
Reach Compliance Code not_compliant not_compliant
ECCN code EAR99 EAR99
Factory Lead Time 12 weeks 12 weeks
maximum clock frequency 667 MHz 667 MHz
Combined latency of CLB-Max 0.71 ns 0.71 ns
JESD-30 code S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 e0
length 17 mm 17 mm
Humidity sensitivity level 3 3
Configurable number of logic blocks 448 448
Equivalent number of gates 200000 200000
Number of entries 195 195
Number of logical units 4032 4032
Output times 160 160
Number of terminals 256 256
Maximum operating temperature 100 °C 85 °C
organize 448 CLBS, 200000 GATES 448 CLBS, 200000 GATES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA
Encapsulate equivalent code BGA256,16X16,40 BGA256,16X16,40
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 240 240
power supply 1.2,2.5/3.3 V 1.2,2.5/3.3 V
Programmable logic type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Certification status Not Qualified Not Qualified
Maximum seat height 1.55 mm 1.55 mm
Maximum supply voltage 1.26 V 1.26 V
Minimum supply voltage 1.14 V 1.14 V
Nominal supply voltage 1.2 V 1.2 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL OTHER
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30
width 17 mm 17 mm
Base Number Matches 1 1

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