Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Winbond(华邦电子) |
Parts packaging code | DIP |
package instruction | DIP, DIP32,.6 |
Contacts | 32 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 90 ns |
Other features | HARDWARE AND SOFTWARE DATA PROTECTION; 20-YEARS DATA RETENTION |
startup block | BOTTOM/TOP |
command user interface | NO |
Data polling | YES |
Data retention time - minimum | 20 |
Durability | 10000 Write/Erase Cycles |
JESD-30 code | R-PDIP-T32 |
JESD-609 code | e0 |
length | 41.91 mm |
memory density | 2097152 bi |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of departments/size | 1,1,1 |
Number of terminals | 32 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP32,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.33 mm |
Department size | 8K,240K,8K |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.05 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | YES |
type | NOR TYPE |
width | 15.24 mm |
Maximum write cycle time (tWC) | 10 ms |