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W29C020C-90B

Description
256k X 8 cmos flash memory
Categorystorage    storage   
File Size189KB,21 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

W29C020C-90B Overview

256k X 8 cmos flash memory

W29C020C-90B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time90 ns
Other featuresHARDWARE AND SOFTWARE DATA PROTECTION; 20-YEARS DATA RETENTION
startup blockBOTTOM/TOP
command user interfaceNO
Data pollingYES
Data retention time - minimum20
Durability10000 Write/Erase Cycles
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.91 mm
memory density2097152 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,1,1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height5.33 mm
Department size8K,240K,8K
Maximum standby current0.0001 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width15.24 mm
Maximum write cycle time (tWC)10 ms

W29C020C-90B Related Products

W29C020C-90B W29C020C-70B W29C020C-70 W29C020C-12B W29C020C-12 W29C020CT90B
Description 256k X 8 cmos flash memory 256k X 8 cmos flash memory 256k X 8 cmos flash memory 256k X 8 cmos flash memory 256k X 8 cmos flash memory 256k X 8 cmos flash memory
Is it Rohs certified? incompatible incompatible - incompatible incompatible incompatible
Parts packaging code DIP DIP - DIP DIP TSOP1
package instruction DIP, DIP32,.6 DIP, DIP32,.6 - DIP, DIP32,.6 0.600 INCH, PLASTIC, DIP-32 TSOP1, TSSOP32,.8,20
Contacts 32 32 - 32 32 32
Reach Compliance Code unknow _compli - _compli unknow unknow
ECCN code EAR99 EAR99 - EAR99 EAR99 EAR99
Maximum access time 90 ns 70 ns - 120 ns 120 ns 90 ns
Other features HARDWARE AND SOFTWARE DATA PROTECTION; 20-YEARS DATA RETENTION HARDWARE AND SOFTWARE DATA PROTECTION; 20-YEARS DATA RETENTION - HARDWARE AND SOFTWARE DATA PROTECTION; 20-YEARS DATA RETENTION - HARDWARE AND SOFTWARE DATA PROTECTION; 20-YEARS DATA RETENTION
startup block BOTTOM/TOP BOTTOM/TOP - BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP
command user interface NO NO - NO - NO
Data polling YES YES - YES - YES
Data retention time - minimum 20 20 - 20 - 20
Durability 10000 Write/Erase Cycles 10000 Write/Erase Cycles - 10000 Write/Erase Cycles - 10000 Write/Erase Cycles
JESD-30 code R-PDIP-T32 R-PDIP-T32 - R-PDIP-T32 R-PDIP-T32 R-PDSO-G32
JESD-609 code e0 e0 - e0 e0 e0
length 41.91 mm 41.91 mm - 41.91 mm 41.91 mm 18.4 mm
memory density 2097152 bi 2097152 bi - 2097152 bi 2097152 bi 2097152 bi
Memory IC Type FLASH FLASH - FLASH FLASH FLASH
memory width 8 8 - 8 8 8
Number of functions 1 1 - 1 1 1
Number of departments/size 1,1,1 1,1,1 - 1,1,1 - 1,1,1
Number of terminals 32 32 - 32 32 32
word count 262144 words 262144 words - 262144 words 262144 words 262144 words
character code 256000 256000 - 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C - 70 °C 70 °C 70 °C
organize 256KX8 256KX8 - 256KX8 256KX8 256KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP - DIP DIP TSOP1
Encapsulate equivalent code DIP32,.6 DIP32,.6 - DIP32,.6 - TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE - IN-LINE IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V - 5 V - 5 V
Programming voltage 5 V 5 V - 5 V 5 V 5 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 5.33 mm 5.33 mm - 5.33 mm 5.33 mm 1.2 mm
Department size 8K,240K,8K 8K,240K,8K - 8K,240K,8K - 8K,240K,8K
Maximum standby current 0.0001 A 0.0001 A - 0.0001 A - 0.0001 A
Maximum slew rate 0.05 mA 0.05 mA - 0.05 mA - 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V - 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V - 5 V 5 V 5 V
surface mount NO NO - NO NO YES
technology CMOS CMOS - CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 2.54 mm - 2.54 mm 2.54 mm 0.5 mm
Terminal location DUAL DUAL - DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES YES - YES - YES
type NOR TYPE NOR TYPE - NOR TYPE NOR TYPE NOR TYPE
width 15.24 mm 15.24 mm - 15.24 mm 15.24 mm 8 mm
Maximum write cycle time (tWC) 10 ms 10 ms - 10 ms 10 ms 10 ms

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