Part Number |
W25X10LSNCG |
W25X10LSSCG |
W25X10LZPCZ |
W25X10LZPIG |
W25X10LZPIZ |
W25X10VDAC |
W25X10VDACG |
W25X10VSNCZ |
W25X10VZPCZ |
W25X10VZPI |
Description |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
1M X 8 FLASH 2.7V PROM, PDSO8 |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
incompatible |
conform to |
conform to |
conform to |
incompatible |
Maker |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Parts packaging code |
SOIC |
SOIC |
SON |
SON |
SON |
DIP |
DIP |
SOIC |
SON |
SON |
package instruction |
0.150 INCH, GREEN, PLASTIC, SOIC-8 |
SOP, SOP8,.3 |
HVSON, SOLCC8,.25 |
HVSON, SOLCC8,.25 |
HVSON, SOLCC8,.25 |
DIP, DIP8,.3 |
DIP, DIP8,.3 |
0.150 INCH, ROHS COMPLIANT, PLASTIC, SOIC-8 |
HVSON, SOLCC8,.25 |
HVSON, SOLCC8,.25 |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
unknow |
compli |
unknow |
unknow |
unknow |
_compli |
compli |
unknow |
unknow |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum clock frequency (fCLK) |
33 MHz |
33 MHz |
33 MHz |
33 MHz |
33 MHz |
33 MHz |
33 MHz |
33 MHz |
33 MHz |
33 MHz |
Data retention time - minimum |
20 |
20 |
20 |
20 |
20 |
20 |
20 |
20 |
20 |
20 |
Durability |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
JESD-30 code |
R-PDSO-G8 |
S-PDSO-G8 |
R-XDSO-N8 |
R-XDSO-N8 |
R-XDSO-N8 |
R-PDIP-T8 |
R-PDIP-T8 |
R-PDSO-G8 |
R-XDSO-N8 |
R-XDSO-N8 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
e0 |
e3 |
e3 |
e3 |
e0 |
length |
4.85 mm |
5.283 mm |
6 mm |
6 mm |
6 mm |
9.14 mm |
9.14 mm |
4.85 mm |
6 mm |
6 mm |
memory density |
1048576 bi |
1048576 bi |
1048576 bi |
1048576 bi |
1048576 bi |
1048576 bi |
1048576 bi |
1048576 bi |
1048576 bi |
1048576 bit |
Memory IC Type |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
memory width |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
word count |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
character code |
1000000 |
1000000 |
1000000 |
1000000 |
1000000 |
1000000 |
1000000 |
1000000 |
1000000 |
1000000 |
Operating mode |
ASYNCHRONOUS |
SYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
85 °C |
85 °C |
70 °C |
70 °C |
70 °C |
70 °C |
85 °C |
organize |
1MX1 |
1MX1 |
1MX1 |
1MX1 |
1MX1 |
1MX1 |
1MX1 |
1MX1 |
1MX1 |
1MX1 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
SOP |
SOP |
HVSON |
HVSON |
HVSON |
DIP |
DIP |
SOP |
HVSON |
HVSON |
Encapsulate equivalent code |
SOP8,.25 |
SOP8,.3 |
SOLCC8,.25 |
SOLCC8,.25 |
SOLCC8,.25 |
DIP8,.3 |
DIP8,.3 |
SOP8,.25 |
SOLCC8,.25 |
SOLCC8,.25 |
Package shape |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
2.5/3 V |
2.5/3 V |
2.5/3 V |
2.5/3 V |
2.5/3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
Programming voltage |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.72 mm |
2.16 mm |
0.8 mm |
0.8 mm |
0.8 mm |
4.45 mm |
4.45 mm |
1.72 mm |
0.8 mm |
0.8 mm |
Serial bus type |
SPI |
SPI |
SPI |
SPI |
SPI |
SPI |
SPI |
SPI |
SPI |
SPI |
Maximum standby current |
0.00001 A |
0.000005 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
Maximum slew rate |
0.025 mA |
0.025 mA |
0.025 mA |
0.025 mA |
0.025 mA |
0.025 mA |
0.025 mA |
0.025 mA |
0.025 mA |
0.025 mA |
Maximum supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
2.7 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
NO |
NO |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
Terminal surface |
MATTE TIN |
MATTE TIN |
MATTE TIN |
MATTE TIN |
MATTE TIN |
TIN LEAD |
MATTE TIN |
MATTE TIN |
MATTE TIN |
TIN LEAD |
Terminal form |
GULL WING |
GULL WING |
NO LEAD |
NO LEAD |
NO LEAD |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
NO LEAD |
NO LEAD |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
40 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
NOT SPECIFIED |
NOT SPECIFIED |
type |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
width |
3.9 mm |
5.283 mm |
5 mm |
5 mm |
5 mm |
7.62 mm |
7.62 mm |
3.9 mm |
5 mm |
5 mm |
write protect |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
Other features |
SYNCHRONOUS MODE ALSO POSSIBLE |
- |
SYNCHRONOUS MODE ALSO POSSIBLE |
SYNCHRONOUS MODE ALSO POSSIBLE |
SYNCHRONOUS MODE ALSO POSSIBLE |
SYNCHRONOUS MODE ALSO POSSIBLE |
SYNCHRONOUS MODE ALSO POSSIBLE |
SYNCHRONOUS MODE ALSO POSSIBLE |
SYNCHRONOUS MODE ALSO POSSIBLE |
SYNCHRONOUS MODE ALSO POSSIBLE |