Part Number |
LPC1114FHN33/202,5 |
LPC1114FHN33/203,5 |
LPC1114FHN33/301,5 |
LPC1114FHN33/302,5 |
LPC1114FHN33/302:5 |
LPC1114FHN33/303,5 |
LPC1114FHN33/333,5 |
Description |
IC MCU 32BIT 32KB FLASH 33HVQFN |
IC MCU 32BIT 32KB FLASH 33HVQFN |
IC MCU 32BIT 32KB FLASH 33HVQFN |
IC MCU 32BIT 32KB FLASH 33HVQFN |
Working voltage: 1.8V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M0 Main frequency (MAX): 50MHz ROM type: FLASH 32-bit ARM Cortex-M0+ microcontroller; 32kB flash, 8kB SRAM , a small package version of LPC1114FBD48 |
IC MCU 32BIT 32KB FLASH 33HVQFN |
IC MCU 32BIT 56KB FLASH 33HVQFN |
Brand Name |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
- |
- |
NXP Semiconductor |
NXP Semiconductor |
Is it Rohs certified? |
conform to |
conform to |
conform to |
- |
- |
conform to |
conform to |
Parts packaging code |
QFN |
QFN |
QFN |
- |
- |
QFN |
QFN |
package instruction |
HVQCCN, LCC32,.27SQ,25 |
HVQCCN, LCC32,.27SQ,25 |
HVQCCN, |
- |
- |
HVQCCN, LCC32,.27SQ,25 |
HVQCCN, LCC32,.27SQ,25 |
Contacts |
32 |
32 |
32 |
- |
- |
32 |
32 |
Manufacturer packaging code |
SOT865-3 |
SOT865-3 |
SOT865-3 |
- |
- |
SOT865-3 |
SOT865-3 |
Reach Compliance Code |
compliant |
compliant |
compliant |
- |
- |
compliant |
compliant |
Has ADC |
YES |
YES |
YES |
- |
- |
YES |
YES |
bit size |
32 |
32 |
32 |
- |
- |
32 |
32 |
CPU series |
CORTEX-M0 |
CORTEX-M0 |
- |
- |
- |
CORTEX-M0 |
CORTEX-M0 |
maximum clock frequency |
25 MHz |
25 MHz |
25 MHz |
- |
- |
25 MHz |
25 MHz |
DMA channel |
NO |
NO |
NO |
- |
- |
NO |
NO |
JESD-30 code |
S-PQCC-N32 |
S-PQCC-N32 |
S-PQCC-N33 |
- |
- |
S-PQCC-N32 |
S-PQCC-N32 |
length |
7 mm |
7 mm |
7 mm |
- |
- |
7 mm |
7 mm |
Humidity sensitivity level |
3 |
3 |
3 |
- |
- |
3 |
3 |
Number of I/O lines |
28 |
28 |
28 |
- |
- |
28 |
28 |
Number of terminals |
33 |
33 |
33 |
- |
- |
33 |
33 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
- |
- |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
- |
- |
-40 °C |
-40 °C |
PWM channel |
NO |
NO |
NO |
- |
- |
NO |
NO |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVQCCN |
HVQCCN |
HVQCCN |
- |
- |
HVQCCN |
HVQCCN |
Encapsulate equivalent code |
LCC32,.27SQ,25 |
LCC32,.27SQ,25 |
- |
- |
- |
LCC32,.27SQ,25 |
LCC32,.27SQ,25 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
- |
- |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
- |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
power supply |
3.3 V |
3.3 V |
- |
- |
- |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
- |
- |
- |
Not Qualified |
Not Qualified |
RAM (bytes) |
4096 |
4096 |
- |
- |
- |
8192 |
8192 |
rom(word) |
32768 |
32768 |
- |
- |
- |
32768 |
57344 |
ROM programmability |
FLASH |
FLASH |
FLASH |
- |
- |
FLASH |
FLASH |
speed |
50 MHz |
50 MHz |
50 MHz |
50MHz |
- |
50 MHz |
50 MHz |
Maximum supply voltage |
3.6 V |
3.6 V |
3.6 V |
- |
- |
3.6 V |
3.6 V |
Minimum supply voltage |
1.8 V |
1.8 V |
1.8 V |
- |
- |
1.8 V |
1.8 V |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
- |
- |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
- |
- |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
- |
- |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
- |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
- |
- |
NO LEAD |
NO LEAD |
Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
- |
- |
0.65 mm |
0.65 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
- |
- |
QUAD |
QUAD |
width |
7 mm |
7 mm |
7 mm |
- |
- |
7 mm |
7 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
- |
- |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
Base Number Matches |
1 |
1 |
1 |
- |
- |
1 |
1 |