Part Number |
EPF10K70RC240-2N |
EPF10K70RC240-2N |
Description |
FPGA - Field Programmable Gate Array FPGA - Flex 10K 468 LABs 189 IOs |
fpga - field programmable gate array fpga - flex 10k 468 labs 189 ios |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Intel |
Altera (Intel) |
package instruction |
HFQFP, HQFP240,1.37SQ,20 |
RQFP-240 |
Reach Compliance Code |
compliant |
unknow |
ECCN code |
3A991 |
3A991 |
JESD-30 code |
S-PQFP-G240 |
S-PQFP-G240 |
JESD-609 code |
e3 |
e3 |
length |
32 mm |
32 mm |
Humidity sensitivity level |
3 |
3 |
Dedicated input times |
4 |
4 |
Number of I/O lines |
189 |
189 |
Number of entries |
189 |
189 |
Number of logical units |
3744 |
3744 |
Output times |
189 |
189 |
Number of terminals |
240 |
240 |
Maximum operating temperature |
70 °C |
70 °C |
organize |
4 DEDICATED INPUTS, 189 I/O |
4 DEDICATED INPUTS, 189 I/O |
Output function |
REGISTERED |
REGISTERED |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HFQFP |
HFQFP |
Encapsulate equivalent code |
HQFP240,1.37SQ,20 |
HQFP240,1.37SQ,20 |
Package shape |
SQUARE |
SQUARE |
Package form |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
Peak Reflow Temperature (Celsius) |
245 |
245 |
power supply |
3.3/5 V |
3.3/5 V |
Programmable logic type |
LOADABLE PLD |
LOADABLE PLD |
propagation delay |
0.4 ns |
0.4 ns |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
4.1 mm |
4.1 mm |
Maximum supply voltage |
5.25 V |
5.25 V |
Minimum supply voltage |
4.75 V |
4.75 V |
Nominal supply voltage |
5 V |
5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) - annealed |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
40 |
40 |
width |
32 mm |
32 mm |