MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 8 X 14 MM, 0.50 MM PITCH, PLASTIC, TSOP1-32
Parameter Name | Attribute value |
Maker | LAPIS Semiconductor Co., Ltd. |
Parts packaging code | TSOP1 |
package instruction | TSSOP, TSSOP32,.56,20 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 100 ns |
JESD-30 code | R-PDSO-G32 |
length | 12.4 mm |
memory density | 4194304 bit |
Memory IC Type | MASK ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP32,.56,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | PARALLEL |
power supply | 3/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.00001 A |
Maximum slew rate | 0.025 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
width | 8 mm |
MR27T401E-XXXTA | MR27T401E-XXXMA | |
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Description | MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 8 X 14 MM, 0.50 MM PITCH, PLASTIC, TSOP1-32 | MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32 |
Maker | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. |
Parts packaging code | TSOP1 | SOIC |
package instruction | TSSOP, TSSOP32,.56,20 | SOP, SOP32,.56 |
Contacts | 32 | 32 |
Reach Compliance Code | unknown | unknown |
ECCN code | EAR99 | EAR99 |
Maximum access time | 100 ns | 100 ns |
JESD-30 code | R-PDSO-G32 | R-PDSO-G32 |
length | 12.4 mm | 21 mm |
memory density | 4194304 bit | 4194304 bit |
Memory IC Type | MASK ROM | MASK ROM |
memory width | 8 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 32 | 32 |
word count | 524288 words | 524288 words |
character code | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 512KX8 | 512KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSSOP | SOP |
Encapsulate equivalent code | TSSOP32,.56,20 | SOP32,.56 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL |
power supply | 3/3.3 V | 3/3.3 V |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 3 mm |
Maximum standby current | 0.00001 A | 0.00001 A |
Maximum slew rate | 0.025 mA | 0.025 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3 V | 3 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 0.5 mm | 1.27 mm |
Terminal location | DUAL | DUAL |
width | 8 mm | 11 mm |