Part Number |
DAC3482IZAYR |
DAC3482IZAY |
Description |
Dual-Channel, 16-Bit, 1.25-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 196-NFBGA -40 to 85 |
Dual-Channel, 16-Bit, 1.25-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 196-NFBGA -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Parts packaging code |
BGA |
BGA |
package instruction |
LFBGA, BGA196,14X14,32 |
LFBGA, BGA196,14X14,32 |
Contacts |
196 |
196 |
Reach Compliance Code |
compli |
compli |
Factory Lead Time |
6 weeks |
6 weeks |
Maximum analog output voltage |
0.6 V |
0.6 V |
Minimum analog output voltage |
-0.5 V |
-0.5 V |
Converter type |
D/A CONVERTER |
D/A CONVERTER |
Enter bit code |
OFFSET BINARY, 2\'S COMPLEMENT BINARY |
OFFSET BINARY, 2\'S COMPLEMENT BINARY |
Input format |
SERIAL |
SERIAL |
JESD-30 code |
S-PBGA-B196 |
S-PBGA-B196 |
JESD-609 code |
e1 |
e1 |
length |
12 mm |
12 mm |
Humidity sensitivity level |
3 |
3 |
Number of digits |
16 |
16 |
Number of functions |
1 |
1 |
Number of terminals |
196 |
196 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LFBGA |
LFBGA |
Encapsulate equivalent code |
BGA196,14X14,32 |
BGA196,14X14,32 |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
1.2,3.3 V |
1.2,3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Sampling rate |
1250 MHz |
1250 MHz |
Maximum seat height |
1.4 mm |
1.4 mm |
Nominal settling time (tstl) |
0.01 µs |
0.01 µs |
Maximum slew rate |
450 mA |
450 mA |
Nominal supply voltage |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
12 mm |
12 mm |