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71V67603S150BGGI

Showing 4 Results for 71V67603S150BGGI, including 71V67603S150BGGI,71V67603S150BGGI, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
71V67603S150BGGI IDT (Integrated Device Technology, Inc.) SRAM 9M 3.3V PBSRAM SLOW P/L Download
71V67603S150BGGI IDT (Integrated Device Technology) PBGA-119, Tray Download
71V67603S150BGGI8 IDT (Integrated Device Technology) PBGA-119, Reel Download
71V67603S150BGGI8 IDT (Integrated Device Technology, Inc.) SRAM 9M 3.3V PBSRAM SLOW P/L Download
71V67603S150BGGI Related Product Datasheets:
Part Number Datasheet
71V67603S150BGGI 、 71V67603S150BGGI8 Download Datasheet
71V67603S150BGGI 、 71V67603S150BGGI8 Download Datasheet
71V67603S150BGGI Related Products:
Part Number 71V67603S150BGGI 71V67603S150BGGI8
Description PBGA-119, Tray PBGA-119, Reel
Brand Name Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code PBGA PBGA
package instruction BGA, BGA119,7X17,50 BGA, BGA119,7X17,50
Contacts 119 119
Manufacturer packaging code BGG119 BGG119
Reach Compliance Code compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A
Is Samacsys N N
Maximum access time 3.8 ns 3.8 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK) 150 MHz 150 MHz
I/O type COMMON COMMON
JESD-30 code R-PBGA-B119 R-PBGA-B119
JESD-609 code e1 e1
length 22 mm 22 mm
memory density 9437184 bit 9437184 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 36 36
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 119 119
word count 262144 words 262144 words
character code 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 256KX36 256KX36
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA119,7X17,50 BGA119,7X17,50
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 2.36 mm 2.36 mm
Maximum standby current 0.07 A 0.07 A
Minimum standby current 3.14 V 3.14 V
Maximum slew rate 0.325 mA 0.325 mA
Maximum supply voltage (Vsup) 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30
width 14 mm 14 mm
Base Number Matches 1 1

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