Part Number |
24LC256-I/SMRVA |
24LC256-I/MNY |
24LC256-I/PRVA |
24LC256-I/PRVE |
24LC256-I/SMVAO |
24LC256-I/SNREL |
24LC256-I/ST |
Description |
32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 |
I2C/2-WIRE SERIAL EEPROM |
32K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 |
EEPROM, 32KX8, Serial, CMOS, PDIP8 |
32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 |
32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
Memory interface type: I2C Memory capacity: 256Kb (32K x 8) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile |
package instruction |
SOP, SOP8,.3 |
TDFN-8 |
DIP, DIP8,.3 |
DIP, |
SOP, SOP8,.3 |
SOP, SOP8,.24 |
TSSOP, TSSOP8,.25 |
Reach Compliance Code |
compli |
compliant |
compli |
compliant |
compli |
compli |
compliant |
Maximum clock frequency (fCLK) |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
Data retention time - minimum |
200 |
200 |
200 |
200 |
200 |
200 |
200 |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-N8 |
R-PDIP-T8 |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
length |
5.26 mm |
3 mm |
9.271 mm |
9.271 mm |
5.26 mm |
4.9 mm |
4.4 mm |
memory density |
262144 bi |
262144 bit |
262144 bi |
262144 bit |
262144 bi |
262144 bi |
262144 bit |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
word count |
32768 words |
32768 words |
32768 words |
32768 words |
32768 words |
32768 words |
32768 words |
character code |
32000 |
32000 |
32000 |
32000 |
32000 |
32000 |
32000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
HVSON |
DIP |
DIP |
SOP |
SOP |
TSSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Maximum seat height |
2.03 mm |
0.8 mm |
5.334 mm |
5.334 mm |
2.03 mm |
1.75 mm |
1.2 mm |
Serial bus type |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
NO |
NO |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
NO LEAD |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
0.5 mm |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
width |
5.25 mm |
2 mm |
7.62 mm |
7.62 mm |
5.25 mm |
3.9 mm |
3 mm |
Maximum write cycle time (tWC) |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
Is it lead-free? |
Lead free |
- |
Lead free |
- |
Lead free |
Contains lead |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
- |
conform to |
conform to |
conform to |
Parts packaging code |
SOIC |
- |
DIP |
- |
SOIC |
SOIC |
SOIC |
Contacts |
8 |
- |
8 |
- |
8 |
8 |
8 |
ECCN code |
EAR99 |
- |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
- |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
I2C control byte |
1010DDDR |
1010DDDR |
1010DDDR |
- |
1010DDDR |
1010DDDR |
1010DDDR |
JESD-609 code |
e3 |
- |
e3 |
- |
e3 |
e3 |
e3 |
Encapsulate equivalent code |
SOP8,.3 |
SOLCC8,.11,20 |
DIP8,.3 |
- |
SOP8,.3 |
SOP8,.24 |
TSSOP8,.25 |
Peak Reflow Temperature (Celsius) |
260 |
- |
NOT SPECIFIED |
- |
260 |
NOT SPECIFIED |
260 |
Certification status |
Not Qualified |
- |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
reverse pinout |
NO |
NO |
NO |
- |
NO |
NO |
NO |
Maximum standby current |
0.000001 A |
0.000005 A |
0.000001 A |
- |
0.000001 A |
0.0000015 A |
0.000005 A |
Maximum slew rate |
0.003 mA |
0.003 mA |
0.003 mA |
- |
0.003 mA |
0.0004 mA |
0.003 mA |
Terminal surface |
Matte Tin (Sn) |
- |
Matte Tin (Sn) |
- |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Maximum time at peak reflow temperature |
40 |
- |
NOT SPECIFIED |
- |
40 |
NOT SPECIFIED |
40 |
write protect |
HARDWARE |
HARDWARE |
HARDWARE |
- |
HARDWARE |
HARDWARE |
HARDWARE |
Base Number Matches |
1 |
- |
1 |
1 |
1 |
1 |
1 |