ZMM5245B_R1_10001 datasheet, PDF

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ZMM5245B_R1_10001: DescriptionAccuracy: ±5% Voltage regulation value (typical value): 15V Reverse leakage current: 0.1uA @11V Maximum power: 500mW; CategoryDiscrete semiconductor diode; File Size103KB，6 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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ZMM5245B_R1_10001 Overview

Accuracy: ±5% Voltage regulation value (typical value): 15V Reverse leakage current: 0.1uA @11V Maximum power: 500mW

ZMM5245B_R1_10001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	O-LELF-R2
Reach Compliance Code	compliant
ECCN code	EAR99
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	16 Ω
JESD-30 code	O-LELF-R2
Maximum knee impedance	600 Ω
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Minimum operating temperature	-65 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.5 W
Nominal reference voltage	15 V
Maximum reverse current	0.1 µA
Reverse test voltage	11 V
surface mount	YES
technology	ZENER
Terminal form	WRAP AROUND
Terminal location	END
Maximum voltage tolerance	5%
Working test current	8.5 mA

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ZMM5221B~ZMM5266B

SURFACE MOUNT ZENER DIODES

VOLTAGE

2.4 to 68 Volts

POWER

500 mWatts

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

0.063(1.6)

0.020(0.5)

0.012(0.3)

0.146(3.7)

0.130(3.3)

0.055(1.4)DIA.

• Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA

• Case: Molded Glass MINI-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight: 0.03 grams

• Packing information

T/R - 2.5K per 7" plastic Reel

0.020(0.5)

0.012(0.3)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Power Dissipation at T

= 25

Operating Junction Temperature Range

Storage Temperature Range

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

Symbol

TOT

STG

Value

500

-65 to +175

Units

Parameter

Thermal Resistance Junction to Ambient Air

Forward Voltage at I

= 200mA

Symbol

JA

Min.

Typ.

Max.

0.3

1.1

Units

C/mW

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

October 21,2013-REV.06

PAGE . 1

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