TS1100S datasheet, PDF - EEWORLD Datasheet

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TS1100S: DescriptionBridge bridge; CategoryDiscrete semiconductor diode; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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TS1100S Overview

Bridge bridge

Features

Product name: Bridge

Product model: TS1100S

Product parameters:

Peak Repetitive Reverse Voltage: VRRM: 100V

Max. Average Rectified Current: IO: 1A

Max. Peak Forward Surge Current: IFSM: 30A

Forward Voltage Drop: VF@IF: 0.7V@0.5A

Max. Reverse Current: IR@VR: 10μA@100V

Package: MICRO DIP/TDI

TS1100S Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
Parts packaging code	DIP
package instruction	R-PDSO-G4
Contacts	4
Reach Compliance Code	_compli
ECCN code	EAR99
Minimum breakdown voltage	100 V
Configuration	BRIDGE, 4 ELEMENTS
Diode component materials	SILICON
Diode type	BRIDGE RECTIFIER DIODE
JESD-30 code	R-PDSO-G4
Maximum non-repetitive peak forward current	30 A
Number of components	4
Phase	1
Number of terminals	4
Maximum operating temperature	125 °C
Minimum operating temperature	-50 °C
Maximum output current	1 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	100 V
surface mount	YES
technology	SCHOTTKY
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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TS1100S

MICRO SURFACE MOUNT SCHOTTKY BRIDGE

VOLTAGE

FEATURES

• Plastic package has Underwriters Laboratory

Flammability Classification 94V-O.

Flame Retardant Epoxy Molding Compound.

• Exceeds environmental standards of MIL-S-19500/228

0.264(6.70)

0.248(6.30)

0.028(0.70)

0.019(0.50)

0.012(0.30)

0.007(0.20)

0.028(0.7)

0.023(0.6)

100 Volts

CURRENT

1.0 Amperes

MICRO DIP / TDI

Unit

：

inch(mm)

• Low forwrd voltge, high current capability

• High surge capacity.

• Super fast recovery times, high voltage.

• Epitaxial chip construction.

• Lead free in comply with EU RoHS 2002/95/EC directives.

• Green molding compound as per IEC61249 Std. . (Halogen Free)

0.179(4.55)

0.167(4.25)

• Low power loss, high efficiency.

0.006(0.15)

0.002(0.05)

0.162(4.10)

0.153(3.90)

0.203(5.15)

0.190(4.85)

MECHANICALDATA

• Terminals: Lead solderable per MIL-STD-750, Method 2026

• Polarity: As marked.

• Standard packaging: Any

• Weight: 0.0032 ounces, 0.09 grams.

0.058(1.45)

0.045(1.15)

• Case: MDI Molded plastic

ABSOLUTE MAXIMUM RA

TINGS (If not specified T

=25

PA RA ME TE R

Ma xi m um P e a k Re p e t i t ve Re ve r s e Vo lt a g e

Ma xi m um RM S Re ve rs e Vo lta g e

Ma xi m um D C B lo c k i ng Vo lta g e

Ma xi m um A ve ra g e F o r wa rd C ur re nt T c = 5 0

S YM B OL

RRM

RM S

F ( AV )

FSM

θJ

, T

S TG

TS 11 0 0 S

100

- 5 0 to + 1 2 5

UNITS

No n-Re p e t i ti ve P e a k S urg e C urr e nt ( S urg e a p p li e d a t ra t e L o a d

c o nd i ti o ns ha lf wa re , s i ng le p ha s e , 6 0 Hz)

Ma xi m um The r ma l Re s i s t a nc e

Op e r a ti ng J unc ti o n a nd S to r a g e Te mp e ra t ur e Ra ng e

C /W

REV.00-DEC.10.2009

PAGE . 1

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