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“Will TSMC run away with Japanese taxpayers’ money?” On July 3, Nikkei Asian Review wrote in a report titled "Attracted by the huge subsidies provided by the Japanese government, TSMC announced tha...[Details]
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Louisville, Colorado, USA – APS announced on March 15, 2022 that Dr. Jerry Broz has joined the company as its new President and Chief Technology Officer.
Jerry Broz holds a Ph.D. in ...[Details]
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On June 8, according to the whistleblower MauriQHD, the US chip giant Qualcomm will launch the next-generation flagship mobile phone SoC "Snapdragon 895" chip, which will be based on the 4nm proce...[Details]
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IQE announces strategic cooperation agreement with SK siltron -Based on IQE’s powerful GaN innovation technology -Industry leaders form partnerships to focus on growth in Asian markets IQE pl...[Details]
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The perovskite light-emitting diode after "solvent screening" treatment exhibits a bright green electroluminescence effect. Photo provided by the interviewed unit Perovskite materials have the advan...[Details]
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Small chip chiplets are one of the hottest technologies in the field of semiconductor manufacturing and packaging. AMD and Intel have launched a variety of small chip designs. Now domestic manufactur...[Details]
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On March 27, the Wall Street Journal reported yesterday that SK Hynix plans to invest approximately US$4 billion (IT Home Note: currently approximately RMB 28.92 billion) to build an advanced chip ...[Details]
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Yesterday, ON Semiconductor and Quantenna Communications, Inc. jointly announced that they have reached a final agreement for ON Semiconductor to acquire Quantenna for $24.50 per share in a full c...[Details]
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Intel's goal is to increase density in packaging by more than 10 times, increase logic scaling by 30% to 50%, and deploy non-silicon-based semiconductors.
In the process of relentles...[Details]
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Last September, NVIDIA announced that it would spend $40 billion to acquire ARM. At that time, they were ambitious and hoped to expand their power in the data center market by acquiring ARM. However,...[Details]
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According to foreign media reports, during the period when the supply of semiconductors such as automotive chips is tight, the production capacity of wafer foundries and packaging and testing manufac...[Details]
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Qorvo, a leading provider of RF solutions, today announced that it has completed the acquisition of Decawave, a pioneer in ultra-wideband (UWB) technology. As a provider of UWB solutions for mobile, ...[Details]
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On the morning of November 26, United Microelectronics Corporation (UMC) and Micron Technology (Micron) announced that they had reached a global settlement agreement. Both parties will withdraw their...[Details]
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On November 3, Cambricon released the third-generation cloud AI chip Siyuan 370, two acceleration cards based on Siyuan 370, MLU370-S4 and MLU370-X4, and the newly upgraded Cambricon Neuware software...[Details]
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On March 25, Microsoft proposed a new method in a recently approved patent to reduce video memory usage through SSD solid-state drives, thereby providing ray tracing performance for games in future...[Details]
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