SMBJ13CA

A state-of-the-art wafer fab in New York and a super materials factory in North Carolina will create a SiC corridor on the East Coast of the United States   Collaboration will result in larger, highl...[Details]

Interview with Mark Lundstrom, Special Advisor to Purdue University As global competition in semiconductor technology intensifies, the United States launched the $280 billion CHIPS Act...[Details]

Engineers have achieved a major breakthrough in semiconductor thermal management by discovering a new heat transfer mode using surface plasmon polaritons (SPP). This novel method improves heat dissip...[Details]

South Korea last week passed a revised bill known as the "Korean Chip Act" that expands tax incentives for investments in the semiconductor industry. But the bill did little to appease industry sta...[Details]

Recently, the State Administration for Market Regulation announced that the Administration has imposed a total fine of 2.5 million yuan on three automotive chip distributors, Shanghai Qiete Electroni...[Details]

Yole Développement expects the advanced packaging market to grow at a CAGR of 6.6% from 2019 to 2025, with a total market value of approximately US$29 billion in 2018 In terms of revenue, mobile an...[Details]

Silicon germanium (SiGe) has become a popular semiconductor material since the 1990s, and its production has skyrocketed. But this semiconductor was not an overnight success. In fact, SiGe, a mixture...[Details]

According to news on June 16, Micron Technology announced today that it plans to invest more than 4.3 billion yuan in its packaging and testing factory in Xi'an, China, in the next few years. The a...[Details]

Recently, media reported that Huawei is building a wafer fab with the assistance of SMIC, trying to make chips by itself in order to break through the US chip ban. The report also pointed out that Hu...[Details]

Scientists from Tokyo Metropolitan University have successfully designed multilayered nanostructures of transition metal dichalcogenides that meet in planes to form junctions. They grew multiple laye...[Details]

 According to news on November 6, high-performance RISC-V CPU design company Ventana has joined forces with Imagination to jointly develop heterogeneous CPU-GPU SoC. The two companies will display th...[Details]

In 2021, Intel will leverage its unique advantages in software, chips and platforms, processes and packaging, and large-scale global manufacturers to promote heterogeneous computing and drive the dig...[Details]

Reuters: According to reports, Dutch Minister of Foreign Trade and Development Cooperation Schreiner Maher sent a letter to the Dutch Parliament saying that due to national security considerations, t...[Details]

Last June, UMC announced that it would spend tens of billions of yen to purchase all the shares of Mie Fujitsu Semiconductor Co., Ltd. (MIFS), a 12-inch wafer fab jointly owned by UMC and Fujitsu Sem...[Details]

In the early morning of August 18th, Beijing time, Cisco today released the company's fourth quarter and full-year financial report for fiscal year 2022. The report shows that Cisco's net revenue in ...[Details]