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SB620F_T0_10001

Description
Rectifier Diode, Schottky, 1 Phase, 1 Element, 6A, 20V V(RRM), Silicon, TO-220AC, ITO-220AC, 3/2 PIN
CategoryDiscrete semiconductor    diode   
File Size231KB,4 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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SB620F_T0_10001 Overview

Rectifier Diode, Schottky, 1 Phase, 1 Element, 6A, 20V V(RRM), Silicon, TO-220AC, ITO-220AC, 3/2 PIN

SB620F_T0_10001 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
package instructionITO-220AC, 3/2 PIN
Reach Compliance Code_compli
ECCN codeEAR99
Other featuresFREE WHEELING DIODE, LOW POWER LOSS
applicationEFFICIENCY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.55 V
JEDEC-95 codeTO-220AC
JESD-30 codeR-PSFM-T2
Maximum non-repetitive peak forward current75 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Maximum output current6 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum repetitive peak reverse voltage20 V
Maximum reverse current200 µA
surface mountNO
technologySCHOTTKY
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED

SB620F_T0_10001 Preview

Download Datasheet
SB620F~SB660F
ISOLATION SCHOTTKY BARRIER RECTIFIERS
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound.
• Low power loss, high efficiency.
• Low forward voltge, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
0.543(13.8)
20 to 60 Volt
CURRENT
6 Ampere
0.112(2.85)
0.100(2.55)
0.272(6.9)
0.248(6.3)
0.406(10.3)
0.381(9.7)
0.134(3.4)
0.118(3.0)
0.189(4.8)
0.165(4.2)
0.130(3.3)
0.114(2.9)
0.063(1.6)MAX.
0.606(15.4)
0.583(14.8)
• Lead free in compliance with EU RoHS 2011/65/EU directive
0.177(4.5)
0.137(3.5)
0.512(13.0)
free wheeling, and polarlity protection applications.
0.055(1.4)
0.039(1.0)
0.055(1.4)
0.039(1.0)
0.028(0.7)
0.019(0.5)
0.100(2.55)
0.114(2.9)
0.098(2.5)
0.100(2.55)
0.027(0.67)
0.022(0.57)
MECHANICAL DATA
• Case: ITO-220AC full molded plastic package
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Weight: 0.055 ounces, 1.5615 grams.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RAM ET ER
M a ximum Rec ur r e nt Pe a k Re ve r s e Vo lt a g e
M a ximum RM S Volt a g e
M a ximum DC Bloc k ing Vo lt a ge
M a ximum Ave r a ge F or w a r d Cur r e nt a t Tc = 7 5
O
C
Pe a k Fo r w ar d Sur g e Cur r e nt : 8 . 3 ms s ing le half s ine - w a ve
s upe r imp o s ed o n r a t e d lo a d
M a ximum Fo r w ar d Vo lt a ge a t 6 A
M a ximum DC Reve r s e Cur r e nt a t Ra t ed DC B lo c k ing
Vo lt a g e
Ty p ic a l T he r ma l Re s is t a nce
O p e r at ing J unc t io n Temp er a t ur e Ra nge
St o r ag e Te mp e r at ur e Ra ng e
T
J
= 2 5
O
C
T
J
= 1 0 0
O
C
SY M B O L SB6 2 0 F S B6 30 F SB6 4 0F SB 65 0 F S B6 60 F
V
RR M
V
RM S
V
DC
I
F( AV )
I
FS M
V
F
I
R
R
θJ
C
T
J
T
ST G
- 5 5 t o + 1 25
0. 5 5
0.2
15
3
- 5 5 t o + 1 50
- 5 5 t o + 15 0
20
14
20
30
21
30
40
28
40
6
75
0.7
0.1
15
50
35
50
60
42
60
0.128(3.25)
MIN.
UNI TS
V
V
V
A
A
V
mA
O
C / W
O
C
C
O
NOTES : Both Bonding and Chip structure are available.
May 17,2016-REV.04
PAGE . 1
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