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PJS6834_S2_00001

Description
Small Signal Field-Effect Transistor
CategoryDiscrete semiconductor    The transistor   
File Size289KB,6 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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PJS6834_S2_00001 Overview

Small Signal Field-Effect Transistor

PJS6834_S2_00001 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
Reach Compliance Codecompliant
ConfigurationSEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage20 V
Maximum drain current (ID)0.75 A
Maximum drain-source on-resistance0.4 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PDSO-G6
Number of components2
Number of terminals6
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
transistor applicationsSWITCHING
Transistor component materialsSILICON

PJS6834_S2_00001 Preview

PPJS6834
20V N-Channel Enhancement Mode MOSFET
Voltage
Features
20 V
Current
750mA
SOT-23 6L
Unit: inch(mm)
Low Voltage Drive (1.2V).
Advanced Trench Process Technology
Specially Designed for Switch Load, PWM Application, etc.
ESD Protected
Lead free in compliance with EU RoHS 2011/65/EU
directive.
Green molding compound as per IEC61249 Std.
(Halogen Free)
Mechanical Data
Case: SOT-23 6L Package
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight: 0.0005 ounces, 0.0141 grams
Marking: SG4
Maximum Ratings and Thermal Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Power Dissipation
(Note 4)
o
SYMBOL
V
DS
V
GS
I
D
I
DM
T
a
=25
o
C
Derate above 25
o
C
P
D
T
J
,T
STG
R
θJA
LIMIT
UNITS
V
V
mA
mA
mW
mW/
o
C
o
20
+10
750
1500
500
4
-55~150
100
o
Operating Junction and Storage Temperature Range
Typical Thermal resistance
-
Junction to Ambient
(Note 3)
C
C/W
May 19,2016-REV.01
Page 1
PPJS6834
Electrical Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
BV
DSS
V
GS(th)
V
GS
=0V, I
D
=250uA
V
DS
=V
GS
, I
D
=250uA
V
GS
=4.5V, I
D
=600mA
V
GS
=2.5V, I
D
=200mA
Drain-Source On-State Resistance
R
DS(on)
V
GS
=1.8V, I
D
=100mA
V
GS
=1.5V, I
D
=50mA
V
GS
=1.2V, I
D
=20mA
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Dynamic
(Note 5)
o
SYMBOL
TEST CONDITION
MIN.
20
0.3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
-
0.65
280
350
400
500
1000
-
+0.5
1.4
0.22
0.21
67
19
6
2.8
20
23
23
MAX.
-
0.9
400
650
800
1200
3000
1
+10
-
-
-
-
-
-
-
-
-
-
UNITS
V
V
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
Ciss
Coss
Crss
td
(on)
tr
td
(off)
tf
V
DS
=16V, V
GS
=0V
V
GS
=+8V, V
DS
=0V
uA
uA
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Drain-Source Diode
Maximum Continuous Drain-Source
Diode Forward Current
Diode Forward Voltage
V
DS
=10V, I
D
=600mA,
V
GS
=4.5V
(Note 1,2)
V
DS
=10V, V
GS
=0V,
f=1.0MHZ
V
DD
=10V, I
D
=150mA,
V
GS
=4.0V,
R
G
=10Ω
(Note 1,2)
nC
pF
ns
I
S
V
SD
---
I
S
=500mA, V
GS
=0V
-
-
-
0.87
500
1.3
mA
V
NOTES :
1. Pulse width<300us, Duty cycle<2%
2. Essentially independent of operating temperature typical characteristics.
3. R
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is
defined as the solder mounting surface of the drain pins mounted on a 1 inch FR-4 with 2oz. square pad of copper.
4. The maximum current rating is package limited.
5. Guaranteed by design, not subject to production testing.
May 19,2016-REV.01
Page 2
PPJS6834
TYPICAL CHARACTERISTIC CURVES
Fig.1 On-Region Characteristics
Fig.2 Transfer Characteristics
Fig.3 On-Resistance vs. Drain Current
Fig.4 On-Resistance vs. Junction temperature
Fig.5 On-Resistance Variation with VGS.
Fig.6 Body Diode Characteristics
May 19,2016-REV.01
Page 3
PPJS6834
TYPICAL CHARACTERISTIC CURVES
Fig.7 Gate-Charge Characteristics
Fig.8 Threshold Voltage Variation with Temperature.
Fig.9 Capacitance vs. Drain-Source Voltage.
May 19,2016-REV.01
Page 4
PPJS6834
PART NO PACKING CODE VERSION
PART NO PACKING CODE
Package Type
SOT-23 6L
SOT-23 6L
Packing type
3K pcs / 7” reel
10K pcs / 13” reel
Marking
SG4
SG4
Version
Halogen free
Halogen free
PJS6834_S1_00001
PJS6834_S2_00001
MOUNTING PAD LAYOUT
May 19,2016-REV.01
Page 5
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