MMSZ5258BS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> MMSZ5258BS

Preview

MMSZ5258BS: DescriptionZener diode; CategoryDiscrete semiconductor; File Size971KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

MMSZ5258BS Overview

Zener diode

Features

Product Name: Zener Diode

Product model: MMSZ5258BS

product features:

Planar Die Construction

Ultra-Small Surface Mount Package

General purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Product parameters:

Pd power dissipation: 200mW

Vz stable voltage: Nom=36V Min=34.20V Max=37.80V

Zzt breakdown impedance: 70Ω

Zzk breakdown impedance: 700Ω

IR reverse current: 0.1uA

Vf forward voltage drop: 0.9V

Package: SOD-323

MMSZ5258BS Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOD-323 Plastic-Encapsulate Diode

MMSZ5221BS-MMSZ5259BS

ZENER DIODE

FEATURES

• Planar Die Construction

• Ultra-Small Surface Mount Package

• General purpose, Medium Current

• Ideally Suited for Automated Assembly Processes

SOD-323

Maximum Ratings(T

=25℃ unless otherwise specified)

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

@ I

= 10mA

Symbol

θJA

STG

Value

0.9

200

625

-65

+150

Unit

℃/W

℃

Notes:1. Device mounted on ceramic PCBS; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm .

2. Tested with pulses, Tp≤1.0ms.

A,Jun,2011

Recommended Resources

The oscillation process of a multivibrator a

Two-channel speaker protection circuit diagram

10A current stabilizer circuit with adjustable output voltage

STR80145 application circuit diagram c

AD7660 negative voltage and positive voltage doubler output circuit diagram

Multi-bit counting circuit for performance

【Awarded】Rewarded Survey——We want you! What does a good reference design website look like?: Award post: Winners list: Prize survey - We want you! What does a good reference design website look like?More exciting gift activities Award-winning live broadcast: Keysight Technologies 100G/400G op...; EEWORLD社区 Integrated technical exchanges

Foreign digital electronics textbooks don’t talk about competition and risk-taking?: I have been reviewing the knowledge of digital circuits recently. I took out the digital electronics textbook that I left behind when I graduated from college and found that the books written by my ow...; lingking Integrated technical exchanges

Share a STLINK V2_1 PCB project, which can be directly sampled and produced: Share a PCB project of STLINK V2_1, which can be directly proofed and producedSupports SWD mode, with virtual serial port, supports USB download,supports automatic firmware upgradeFirmware refer to th...; 通宵敲代码 stm32/stm8

STM32 Global Unique ID Reading Method: The unique product identifier is very suitable for:● Used as a serial number (such as a USB character serial number or other terminal applications)● Used as a password. When programming the flash memo...; fish001 Microcontroller MCU

Qualcomm wins injunction, Chinese court bans sale of several iPhones: [align=left]Qualcomm has scored a major victory in its ongoing legal battle with Apple: The chipmaker has won a preliminary injunction from a Chinese court that bans the sale and importation of many o...; 朗锐智科 RF/Wirelessly

RF microwave - Qorvo has a good interpretation of this material [gallium arsenide and gallium nitride]: Star materials in the RF field: GaAs and GaNSemiconductor raw materials have gone through three stages of development: the first stage was the first-generation semiconductor raw materials represented ...; btty038 RF/Wirelessly

Popular Components