MMSZ5241C datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> MMSZ5241C

Preview

MMSZ5241C: DescriptionZener diode; CategoryDiscrete semiconductor; File Size910KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

MMSZ5241C Overview

Zener diode

Features

Product Name: Zener Diode

Product model: MMSZ5241C

product features:

Planar Die Construction

Ultra-Small Surface Mount Package

General purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Product parameters:

Pd dissipated power: 350mW

Vz stable voltage: Nom=11V Min=10.78V Max=11.22V

Zzt breakdown impedance: 22Ω

Zzk breakdown impedance: 600Ω

IR reverse current: 2uA

Vf forward voltage drop: 0.9V

Package: SOD-123

MMSZ5241C Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOD-123 Plastic-Encapsulate Diode

MMSZ5221C-MMSZ5259C

ZENER DIODE

FEATURES

• Planar Die Construction

• Ultra-Small Surface Mount Package

• General purpose, Medium Current

• Ideally Suited for Automated Assembly Processes

SOD-123

Maximum Ratings

=25℃ unless otherwise specified)

Symbol

@ I

= 10mA

θJA

STG

Value

0.9

350

357

-65

+150

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

Unit

℃/W

℃

Notes:1. Device mounted on ceramic PCB;

5.0mm

7.0

mm with pad areas

mm .

2. Tested with pulses, Tp≤1.0ms.

B,Jan,2012

Recommended Resources

Satellite receiving antenna follow-up control circuit diagram

LS7261-LS7262 three-phase full-wave output circuit

μPD6102G (TVs, VCRs, audio equipment and toys) infrared remote control transmitter circuit

Gaobin brand LP-12 heating and cooling air conditioning fan circuit diagram

Series switching power supply

Playing with Zynq Serial 14 - Using GIT for Project Backup and Version Management 6: 2.6 Application of GIT branches Inthe Show log , we can see that the latest version of the current master is ver2 . If we want to go back to ver1 to change the file, we cannot reset "master" to this.....; ove学习使我快乐 FPGA/CPLD

Selection of solid state relays: 1. Select the type of solid-state relay When selecting a solid-state relay, the power type and load capacity of the solid-state relay should be determined based on the power type, power voltage and po...; tiankai001 Integrated technical exchanges

TWS earphones product display: After several months of research and development, testing, it is finally put into production and sold online. I am so happy! Show the following pictures:...; Fred_1977 Talking

【Silicon Labs Development Kit Review】+Data Collection: [i=s]This post was last edited by dql2016 on 2021-7-25 14:13[/i]The EFM32PG22 official website provides a lot of detailed information. The PG22 Development Kit is a development platform for the EFM32P...; dql2016 Development Kits Review Area

How to evaluate MCU performance parameters? From which perspectives?: How to evaluate MCU performance parameters? From which perspectives?...; QWE4562009 ARM Technology

Renesas CPK-RA6M4 Development Board Review ---- CAN: [i=s]This post was last edited by chen@peng on 2022-5-21 10:44[/i]The main content of this evaluation is the CAN communication of RAM4You can learn the basic knowledge of CAN communication by yourself...; chen@peng Renesas Electronics MCUs

Popular Components