PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
In PCB design, pad is a very important concept, and PCB engineers must be familiar with it. However, although they are familiar with it, many engineers have only a superficial understanding of pad.Tod...
On January 26, on multiple social platforms such as Maimai, the topic of "Tencent freshman angrily criticized the leader for working too much overtime" became a hot topic, sparking a lot of discussion...
The specific phenomenon is described as follows:
The current circuit is composed of a display panel, a keypad, and a control panel. I first perform an operation by pressing a key, which corresponds to...
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In order to improve the functions of the forum and provide a better user experience,
From now on, we are asking everyon...
Light-emitting diodes (LEDs) have moved from being the dominant choice for electronic device indicators to being the primary focus for making lighting more energy efficient. The ability to efficiently...
As the country with the most advanced semiconductor technology in the world, the latest process in the United States is still 14nm, which is already behind TSMC. In May this year, TSMC announced the ...[Details]
According to Taiwanese media MoneyDJ, affected by the sharp drop in terminal demand, a cold wind is blowing in the semiconductor industry, including major technology companies such as Micron, Microso...[Details]
On December 22-23, at the 2021 China Integrated Circuit Design Industry Annual Conference and Wuxi Integrated Circuit Industry Innovation and Development Summit Forum (ICCAD 2021), Dr. Yang Yi, Gener...[Details]
On May 19, 2023, Renesas Electronics announced the company's 2030 vision at the 2023 Investor Day: by then, the company's total revenue will exceed 20 billion US dollars, and it hopes to become the t...[Details]
Recently, the COVID-19 outbreak in Tianjin has resurged, and the production and operation of SMIC's local wafer factory has attracted much attention from the industry. In response, SMIC stated that...[Details]
According to Taiwan Electronics Times on February 20, the semiconductor supply chain stated that not only did TSMC’s existing process capacity utilization rebound, its 2-nanometer progress was also b...[Details]
Compared with other component distributors, Future Electronics has obvious advantages. This private company founded by Mr. Robert Miller in 1968 can flexibly provide services and long-term layout acc...[Details]
According to the Economic Daily, the global chip war has entered a white-hot stage. The IC supply gap has increased instead of decreased in the second quarter, which has significantly affected the sh...[Details]
Samsung Electronics reportedly announced today that it will merge its mobile and consumer electronics divisions to focus on developing its logic chip business. The massive move is the latest sign o...[Details]
Beijing time, September 23rd morning news, according to people familiar with the matter, Intel Corp. CEO Pat Gelsinger plans to attend an online meeting held at the White House to discuss the global ...[Details]
Recently, Lian Weihan, chief architect of Tenstorrent, shared the combination of RISC-V architecture and AI innovation at the "2024 World Artificial Intelligence Conference" - "Intelligence from th...[Details]
2021 is a special year for the electronic components industry, in which suppliers, distributors and customers have encountered many unprecedented challenges. However, it is these challenges that brin...[Details]
Industry insiders said that when Samsung told engineers in its dominant memory chip team they were being moved to the processor chip division, they often asked what they had done wrong. The process...[Details]
According to Reuters, the Dutch government plans to announce new regulations on June 30, local time, to impose licensing requirements on ASML's sub-top product line deep ultraviolet DUV lithography m...[Details]
July 16 news, MoneyDJ reported yesterday (July 15) that TSMC has formed a special team to explore a new packaging solution for fan-out panel-level packaging (FOPLP), and plans to build a small pilo...[Details]