Storage Temperature ........................................................................................................................... -50 ~ +150
°C
Junction Temperature ..................................................................................................................... 150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (T
C
=25°C) .................................................................................................................... 35 W
•
Maximum Voltages and Currents (T
A
=25°C)
V
CEX
Collector to Emitter Voltage ...................................................................................................................... 700 V
V
CEO
Collector to Emitter Voltage...................................................................................................................... 400 V
V
EBO
Emitter to Base Voltage................................................................................................................................ 9 V
I
C
Collector Current ........................................................................................................................ Continuous 1.5 A
I
B
Base Current ............................................................................................................................. Continuous 0.75 A
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CEX
BV
CEO
I
EBO
I
CEX
*V
CE(sat)1
*V
CE(sat)2
*V
CE(sat)3
*V
BE(sat)
*V
BE(sat)
*h
FE1
*h
FE2
Min.
700
400
-
-
-
-
-
-
-
8
5
Typ.
-
-
-
-
-
-
-
-
-
-
-
Max.
-
-
1
1
500
1
3
1
1.2
40
25
Unit
V
V
mA
mA
mV
V
V
V
V
I
C
=10mA
V
EB
=9V
V
CE
=700V, V
BE(off)
=1.5V
I
C
=0.5A, I
B
=0.1A
I
C
=1A, I
B
=0.25A
I
C
=1.5A, I
B
=0.5A
I
C
=0.5A, I
B
=0.1A
I
C
=1A, I
B
=0.25A
I
C
=0.5A, V
CE
=2V
I
C
=1A, V
CE
=2V
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Test Conditions
I
C
=1mA, V
BE(off)
=1.5V
HMJE13003E
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100
1000
V
CE(sat)
@ I
C
=3I
B
Spec. No. : HE200502
Issued Date : 2005.10.01
Revised Date : 2009.10.14
Page No. : 2/4
Saturation Voltage & Collector Current
125 C
o
75 C
o
Saturation Voltage (mV)
75
o
C
25
o
C
hFE
10
100
125
o
C
hFE @ V
CE
=2V
25
o
C
1
0.1
1
100
Collector Current-I
C
(mA)
10
1000
10000
10
1
10
100
1000
10000
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
10000
V
CE(sat)
@ I
C
=4I
B
10000
Saturation Voltage & Collector Current
V
CE(sat)
@ I
C
=5I
B
Saturation Voltage (mV)
1000
75
o
C
125
o
C
100
Saturation Vpltage (mV)
1000
75
o
C
125
o
C
100
25
o
C
25 C
o
10
1
10
100
1000
10000
10
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
10000
V
BE(sat)
@ I
C
=4I
B
Saturation Voltage & Collector Current
10000
V
BE(sat)
@ I
C
=5I
B
Saturation Voltage (mV)
Saturation Voltage (mV)
75
o
C
1000
25
o
C
75
o
C
1000
25
o
C
125
o
C
125
o
C
100
1
10
100
1000
10000
100
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
HMJE13003E
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking:
A
D
B
E
C
F
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
H
Spec. No. : HE200502
Issued Date : 2005.10.01
Revised Date : 2009.10.14
Page No. : 3/4
MJ E
13003
Control Code
H
I
G
Tab
P
L
J
M
3
2
1
O
N
K
Date Code
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
-
3.00
0.75
2.54
1.14
-
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong
Tel: +852-2755-7162 Fax: +852-2755- 7795
AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, Chin
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