GD32F103T4U6 datasheet, PDF - EEWORLD Datasheet

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GD32F103T4U6: DescriptionARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 108; Memory (Bytes) Flash: 16K; Memory (Bytes) SRAM: 6K; I/O: up to 26; Timer GPTM (16bit): 2; Timer Advanced TM (16bit): 1; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 1; Connectivity SPI: 1; Connectivity USB 2 FS: 1; Analog Interface 12bit ADC Units (CHs): 2(10); Package: QFN36; CategoryThe embedded processor and controller Microcontrollers and processors; File Size929KB，76 Pages; ManufacturerGigaDevice; Websitehttp://www.gigadevice.com; Founded in Silicon Valley in 2005, GigaDevice is a leading fabless semiconductor company dedicated to providing advanced storage technologies and IC solutions. The company successfully completed its IPO on the Shanghai Stock Exchange in 2016. GigaDevice offers a wide range of high-performance flash memory and 32-bit general-purpose MCU products. It is one of the pioneers of SPI NOR flash memory and currently ranks third in the world in this market segment, with more than 1 billion units shipped annually.

Since 2007, GigaDevice has filed more than 600 patent applications and obtained more than 200 patents. More than 55% of employees are engaged in research and development, which is the basis for continuously differentiating its products from competitors in the market. The GigaDevice management team has absorbed the leading semiconductor industry experience of well-known storage companies in Silicon Valley, South Korea and Taiwan. GigaDevice has passed ISO9001 and ISO14001 certifications from DQS.

GigaDevice currently produces SPI NOR Flash, SPI NAND Flash, and MCUs for embedded, consumer, and mobile communications applications. Its manufacturing model is based on strong relationships with foundry, assembly, and test subcontractor partners. GigaDevice believes that this clearly defined fabless manufacturing model offers a competitive advantage over traditional manufacturing-based integrated device manufacturers because capital equipment expenditures to maintain advanced memory process technologies exceed market returns in many IC memory market sectors. GigaDevice's foundry partners' continued investment in advanced equipment and their rapid growth in 12" wafer capacity are key factors in its success over competitors.

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GD32F103T4U6 Overview

ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 108; Memory (Bytes) Flash: 16K; Memory (Bytes) SRAM: 6K; I/O: up to 26; Timer GPTM (16bit): 2; Timer Advanced TM (16bit): 1; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 1; Connectivity SPI: 1; Connectivity USB 2 FS: 1; Analog Interface 12bit ADC Units (CHs): 2(10); Package: QFN36

GD32F103T4U6 Parametric

Parameter Name	Attribute value
Parts packaging code	QFN36
Reach Compliance Code	unknown
Base Number Matches	1
Max Speed (MHz)	108
Memory (Bytes) Flash	16K
Memory (Bytes) SRAM	6K
I/O	up to 26
Timer GPTM (32bit)
Timer GPTM (16bit)	2
Timer Advanced TM (16bit)	1
Timer Basic TM (16bit)
Timer SysTick (24bit)	1
Timer WDG	2
Timer RTC	1
Connectivity USART
Connectivity I2C	1
Connectivity SPI	1
Connectivity USB 2 FS	1
Connectivity I2S
Connectivity Comp
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)	2(10)
Analog Interface 12bit DAC Units
Package	QFN36

User Manual

【Manual】GD32F103T4U6 User Manual

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GigaDevice Semiconductor Inc.

GD32F103xx

ARM

Cortex

™

-M3 32-bit MCU

Datasheet

GD32F103xx Datasheet

Table of Contents

Table of Contents ........................................................................................................... 1

List of Figures ................................................................................................................ 3

List of Tables .................................................................................................................. 4

1. General description ................................................................................................. 5

2. Device overview ....................................................................................................... 6

2.1. Device information .......................................................................................................... 6

2.2. Block diagram ................................................................................................................. 9

2.3. Pinouts and pin assignment ........................................................................................ 11

2.4. Memory map .................................................................................................................. 15

2.5. Clock tree ...................................................................................................................... 19

2.6. Pin definitions ............................................................................................................... 20

2.6.1.

2.6.2.

2.6.3.

2.6.4.

2.6.5.

GD32F103Zx LQFP144 pin definitions ................................................................................. 20

GD32F103Vx LQFP100 pin definitions ................................................................................ 28

GD32F103Rx LQFP64 pin definitions .................................................................................. 35

GD32F103Cx LQFP48 pin definitions .................................................................................. 39

GD32F103Tx QFN36 pin definitions .................................................................................... 42

3. Functional description .......................................................................................... 44

3.1. ARM® Cortex™-M3 core............................................................................................... 44

3.2. On-chip memory ........................................................................................................... 44

3.3. Clock, reset and supply management ......................................................................... 45

3.4. Boot modes ................................................................................................................... 45

3.5. Power saving modes .................................................................................................... 47

3.6. Analog to digital converter (ADC) ................................................................................ 47

3.7. Digital to analog converter (DAC) ................................................................................ 48

3.8. DMA ............................................................................................................................... 48

3.9. General-purpose inputs/outputs (GPIOs) .................................................................... 48

3.10.

3.11.

3.12.

3.13.

Timers and PWM generation ................................................................................. 49

Real time clock (RTC) ............................................................................................ 50

Inter-integrated circuit (I2C) .................................................................................. 50

Serial peripheral interface (SPI) ............................................................................ 51

GD32F103xx Datasheet

3.14.

3.15.

3.16.

3.17.

3.18.

3.19.

3.20.

3.21.

Universal synchronous asynchronous receiver transmitter (USART) ............... 51

Inter-IC sound (I2S) ................................................................................................ 51

Secure digital input and output card interface (SDIO) ......................................... 52

Universal serial bus full-speed device (USBD) .................................................... 52

Controller area network (CAN) .............................................................................. 52

External memory controller (EXMC) ..................................................................... 52

Debug mode ........................................................................................................... 53

Package and operation temperature ..................................................................... 53

4. Electrical characteristics ....................................................................................... 54

4.1. Absolute maximum ratings .......................................................................................... 54

4.2. Recommended DC characteristics .............................................................................. 54

4.3. Power consumption ...................................................................................................... 55

4.4. EMC characteristics ...................................................................................................... 60

4.5. Power supply supervisor characteristics.................................................................... 60

4.6. Electrical sensitivity ..................................................................................................... 62

4.7. External clock characteristics...................................................................................... 63

4.8. Internal clock characteristics ....................................................................................... 64

4.9. PLL characteristics ....................................................................................................... 65

4.10.

4.11.

4.12.

4.13.

4.14.

4.15.

Memory characteristics ......................................................................................... 65

GPIO characteristics .............................................................................................. 65

ADC characteristics ............................................................................................... 67

DAC characteristics ............................................................................................... 67

I2C characteristics ................................................................................................. 67

SPI characteristics ................................................................................................. 68

5. Package information.............................................................................................. 69

5.1. QFN package outline dimensions ................................................................................ 69

5.2. LQFP package outline dimensions .............................................................................. 70

6. Ordering Information ............................................................................................. 72

7. Revision History..................................................................................................... 74

GD32F103xx Datasheet

List of Tables

Table 2-1. GD32F103xx devices features and peripheral list

.................................................................. 6

Table 2-2. GD32F103xx devices features and peripheral list (continued)

............................................. 7

Table 2-3. GD32F103xx devices features and peripheral list (continued)

............................................. 8

Table 2-4. GD32F103xx memory map

...................................................................................................... 15

Table 2-5. GD32F103Zx LQFP144 pin definitions

................................................................................... 20

Table 2-6. GD32F103Vx LQFP100 pin definitions

................................................................................... 28

Table 2-7. GD32F103Rx LQFP64 pin definitions

.................................................................................... 35

Table 2-8. GD32F103Cx LQFP48 pin definitions

.................................................................................... 39

Table 2-9. GD32F103Tx QFN36 pin definitions

....................................................................................... 42

Table 4-1. Absolute maximum ratings

..................................................................................................... 54

Table 4-2. DC operating conditions

......................................................................................................... 54

Table 4-3. Power consumption characteristics (for GD32F103x4/6/8/B devices)

............................... 55

Table 4-4. Power consumption characteristics (for GD32F103xC/D/E/F/G/I/K devices)

.................... 56

Table 4-5. Power consumption of peripherals (for GD32F103x4/6/8/B devices)

................................. 57

Table 4-6. Power consumption of peripherals (for GD32F103xC/D/E/F/G/I/K devices)

...................... 58

Table 4-7. EMS characteristics

................................................................................................................. 60

Table 4-8. EMI characteristics

.................................................................................................................. 60

Table 4-9. Power supply supervisor characteristics (for GD32F103x4/6/8/B devices)

....................... 60

Table 4-10. Power supply supervisor characteristics (for GD32F103xC/D/E/F/G/I/K devices)

.......... 60

Table 4-11. ESD characteristics

............................................................................................................... 62

Table 4-12. Static latch-up characteristics

.............................................................................................. 62

Table 4-13. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics

. 63

Table 4-14. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics

.. 63

Table 4-15. High speed internal clock (IRC8M) characteristics

............................................................ 64

Table 4-16. Low speed internal clock (IRC40K) characteristics

........................................................... 64

Table 4-17. PLL characteristics

................................................................................................................ 65

Table 4-18. Flash memory characteristics

.............................................................................................. 65

Table 4-19. I/O port characteristics (for GD32F103x4/6/8/B devices)

................................................... 65

Table 4-20. I/O port characteristics (for GD32F103xC/D/E/F/G/I/K devices)

........................................ 66

Table 4-21. ADC characteristics

............................................................................................................... 67

Table 4-22. DAC characteristics

............................................................................................................... 67

Table 4-23. I2C characteristics

................................................................................................................. 67

Table 4-24. Standard SPI characteristics

................................................................................................ 68

Table 5-1. QFN package dimensions

....................................................................................................... 69

Table 5-2. LQFP package dimensions

..................................................................................................... 71

Table 6-1. Part ordering code for GD32F103xx devices

........................................................................ 72

Table 7-1. Revision history

....................................................................................................................... 74

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