DZ23C3V6 datasheet, PDF - EEWORLD Datasheet

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DZ23C3V6: DescriptionZener diode; CategoryDiscrete semiconductor; File Size554KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

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DZ23C3V6 Overview

Zener diode

Features

Product Name: Zener Diode

Product model: DZ23C3V6

product features:

Dual zeners common cathode configuration

300mW Power Dissipation

Ideally suited for automated insertion

Zener Voltages from 2.7V -51V

Ultra-Small Surface Mount Package Power dissipation

Product parameters:

Pd power dissipation: 300mW

Vz stable voltage: Nom=3.6V Min=3.4V Max=3.8V

Zzt breakdown impedance: 95Ω

Zzk breakdown impedance: 500Ω

IR reverse current: 0.1uA

Vf forward voltage drop: 0.9V

Package: SOT-23

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JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-23 Plastic-Encapsulate DIODE

SOT-23

DZ23C2V7-DZ23C51

ZENER DIODE

FEATURES

Dual zeners common cathode configuration

300mW Power Dissipation

Ideally suited for automated insertion

Zener Voltages from 2.7V -51V

Ultra-Small Surface Mount Package Power dissipation

Maximum Ratings

=25℃ unless otherwise specified)

Characteristic

Forward Voltage @ I

= 10mA

Power Dissipation(Note 1)

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

Symbol

θJA

STG

Value

0.9

300

417

-65~ +150

Unit

℃/W

℃

Notes: 1. Valid provided that device terminals are kept at ambient temperature.

A,Jun,2011

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