D32F403VCH6 datasheet, PDF - EEWORLD Datasheet

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D32F403VCH6: DescriptionARM® Cortex®-M4 32-bit MCU, Max Speed (MHz): 168; Memory (Bytes) Flash: 256K; Memory (Bytes) SRAM: 64K; I/O: up to 80; Timer GPTM (16bit): 8; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: OTG; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: BGA100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，54 Pages; ManufacturerGigaDevice; Websitehttp://www.gigadevice.com; Founded in Silicon Valley in 2005, GigaDevice is a leading fabless semiconductor company dedicated to providing advanced storage technologies and IC solutions. The company successfully completed its IPO on the Shanghai Stock Exchange in 2016. GigaDevice offers a wide range of high-performance flash memory and 32-bit general-purpose MCU products. It is one of the pioneers of SPI NOR flash memory and currently ranks third in the world in this market segment, with more than 1 billion units shipped annually.

Since 2007, GigaDevice has filed more than 600 patent applications and obtained more than 200 patents. More than 55% of employees are engaged in research and development, which is the basis for continuously differentiating its products from competitors in the market. The GigaDevice management team has absorbed the leading semiconductor industry experience of well-known storage companies in Silicon Valley, South Korea and Taiwan. GigaDevice has passed ISO9001 and ISO14001 certifications from DQS.

GigaDevice currently produces SPI NOR Flash, SPI NAND Flash, and MCUs for embedded, consumer, and mobile communications applications. Its manufacturing model is based on strong relationships with foundry, assembly, and test subcontractor partners. GigaDevice believes that this clearly defined fabless manufacturing model offers a competitive advantage over traditional manufacturing-based integrated device manufacturers because capital equipment expenditures to maintain advanced memory process technologies exceed market returns in many IC memory market sectors. GigaDevice's foundry partners' continued investment in advanced equipment and their rapid growth in 12" wafer capacity are key factors in its success over competitors.

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D32F403VCH6 Overview

ARM® Cortex®-M4 32-bit MCU, Max Speed (MHz): 168; Memory (Bytes) Flash: 256K; Memory (Bytes) SRAM: 64K; I/O: up to 80; Timer GPTM (16bit): 8; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: OTG; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: BGA100

D32F403VCH6 Parametric

Parameter Name	Attribute value
Parts packaging code	BGA100
Reach Compliance Code	unknown
Base Number Matches	1
Max Speed (MHz)	168
Memory (Bytes) Flash	256K
Memory (Bytes) SRAM	64K
I/O	up to 80
Timer GPTM (32bit)
Timer GPTM (16bit)	8
Timer Advanced TM (16bit)	2
Timer Basic TM (16bit)	2
Timer SysTick (24bit)
Timer WDG	2
Timer RTC	1
Connectivity USART
Connectivity I2C	2
Connectivity SPI	3
Connectivity USB 2 FS	OTG
Connectivity I2S	2
Connectivity Comp
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)	3(16)
Analog Interface 12bit DAC Units	2
Package	BGA100

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GigaDevice Semiconductor Inc.

GD32F403xx

ARM

Cortex

-M4 32-bit MCU

Datasheet

GD32F403xx

Table of Contents

List of Figures

............................................................................................................................. 3

List of Tables

............................................................................................................................... 4

2.1

2.2

2.3

2.4

2.5

2.6

General description

......................................................................................................... 5

Device overview

............................................................................................................... 6

Device information

.............................................................................................................................. 6

Block diagram

...................................................................................................................................... 8

Pinouts and pin assignment

.............................................................................................................. 9

Memory map

...................................................................................................................................... 13

Clock tree

........................................................................................................................................... 17

Pin definitions

.................................................................................................................................... 18

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

3.11

3.12

3.13

3.14

3.15

3.16

3.17

3.18

3.19

3.20

3.21

Functional description

.................................................................................................. 26

ARM

Cortex

-M4 core

.................................................................................................................... 26

On-chip memory

................................................................................................................................ 27

Clock, reset and supply management

........................................................................................... 27

Boot modes

........................................................................................................................................ 28

Power saving modes

........................................................................................................................ 28

Analog to digital converter (ADC)

................................................................................................... 29

Digital to analog converter (DAC)

................................................................................................... 29

DMA

.................................................................................................................................................... 30

General-purpose inputs/outputs (GPIOs)

...................................................................................... 30

Timers and PWM generation

........................................................................................................... 31

Real time clock (RTC)

...................................................................................................................... 32

Inter-integrated circuit (I2C)

............................................................................................................. 32

Serial peripheral interface (SPI)

...................................................................................................... 33

Universal synchronous asynchronous receiver transmitter (USART)

....................................... 33

Inter-IC sound (I2S)

.......................................................................................................................... 33

Secure digital input and output card interface (SDIO)

................................................................. 34

Universal serial bus on-the-go full-speed (USB OTG FS)

.......................................................... 34

Controller area network (CAN)

........................................................................................................ 34

External memory controller (EXMC)

.............................................................................................. 35

Debug mode

...................................................................................................................................... 35

Package and operation temperature

.............................................................................................. 35

4.1

4.2

4.3

4.4

4.5

Electrical characteristics

.............................................................................................. 36

Absolute maximum ratings

.............................................................................................................. 36

Recommended DC characteristics

................................................................................................. 36

Power consumption

.......................................................................................................................... 37

EMC characteristics

.......................................................................................................................... 38

Power supply supervisor characteristics

....................................................................................... 39

GD32F403xx

4.6

4.7

4.8

4.9

4.10

4.11

4.12

4.13

4.14

4.15

4.16

Electrical sensitivity...........................................................................................................................

External clock characteristics

.......................................................................................................... 40

Internal clock characteristics

........................................................................................................... 41

PLL characteristics

........................................................................................................................... 42

Memory characteristics

.................................................................................................................... 43

GPIO characteristics

......................................................................................................................... 44

ADC characteristics

.......................................................................................................................... 45

DAC characteristics

.......................................................................................................................... 47

SPI characteristics

............................................................................................................................ 48

I2C characteristics

............................................................................................................................ 48

USART characteristics

..................................................................................................................... 48

5.1

5.2

Package information

..................................................................................................... 49

LQFP package outline dimensions

................................................................................................ 49

BGA package outline dimensions

.................................................................................................. 51

Ordering Information

..................................................................................................... 52

Revision History

............................................................................................................. 53

GD32F403xx

List of Tables

Table 1. GD32F403xx devices features and peripheral list

................................................................................... 6

Table 2. GD32F403xx pin definitions

...................................................................................................................... 18

Table 3. Absolute maximum ratings

........................................................................................................................ 36

Table 4. DC operating conditions

............................................................................................................................ 36

Table 5. Power consumption characteristics

......................................................................................................... 37

Table 6. EMS characteristics

................................................................................................................................... 38

Table 7. EMI characteristics

..................................................................................................................................... 38

Table 8. Power supply supervisor characteristics

................................................................................................. 39

Table 9. ESD characteristics

.................................................................................................................................... 39

Table 10. Static latch-up characteristics

................................................................................................................ 39

Table 11. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics..................

Table 12. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics

................... 40

Table 13. High speed internal clock (IRC8M) characteristics

.............................................................................. 41

Table 14. High speed internal clock (IRC48M) characteristics

........................................................................... 41

Table 15. Low speed internal clock (IRC32K) characteristics

............................................................................. 42

Table 16. PLL characteristics

................................................................................................................................... 42

Table 17. PLL2/3 characteristics

............................................................................................................................. 42

Table 18. Flash memory characteristics

................................................................................................................. 43

Table 19. I/O port characteristics

............................................................................................................................. 44

Table 20. ADC characteristics

.................................................................................................................................. 45

Table 21. ADC R

AIN max

for f

ADC

=40MHz

................................................................................................................. 45

Table 22. ADC dynamic accuracy at f

ADC

= 30 MHz

............................................................................................. 46

Table 23. ADC dynamic accuracy at f

ADC

= 30 MHz

............................................................................................. 46

Table 24. ADC dynamic accuracy at f

ADC

= 36 MHz

............................................................................................. 46

Table 25. ADC dynamic accuracy at f

ADC

= 40 MHz

............................................................................................. 46

Table 26. ADC static accuracy at f

ADC

= 15 MHz

.................................................................................................. 46

Table 27. DAC characteristics

................................................................................................................................. 47

Table 28. SPI characteristics

.................................................................................................................................... 48

Table 29. I2C characteristics

.................................................................................................................................... 48

Table 30. USART characteristics

............................................................................................................................ 48

Table 31. LQFP package dimensions

..................................................................................................................... 50

Table 32. BGA package dimensions

....................................................................................................................... 51

Table 33. Part ordering code for GD32F403xx devices

....................................................................................... 52

Table 34. Revision history.........................................................................................................................................

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