BZX84C2V4T datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> BZX84C2V4T

Preview

BZX84C2V4T: DescriptionZener diode; CategoryDiscrete semiconductor; File Size500KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

BZX84C2V4T Overview

Zener diode

Features

Product Name: Zener Diode

Product model: BZX84C2V4T

product features:

150mW power dissipation rating.

Ultra-Small Surface Mount Package

Planar Die Construction

Lead Free/RoHS Compliant

Product parameters:

Pd dissipated power: 150mW

Vz stable voltage: Nom=2.4V Min=2.2V Max=2.6V

Zzt breakdown impedance: 100Ω

Zzk breakdown impedance: 600Ω

IR reverse current: 50uA

Vf forward voltage drop: 0.9V

Package: SOT-523

BZX84C2V4T Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-523 Plastic-Encapsulate Diode

BZX84C2V4T-BZX84C39T

ZENER DIODE

FEATURES：

∙

SOT-523

150mW

power dissipation rating.

Maximum Ratings(T

=25℃ unless otherwise specified)

A,Jun,2011

Recommended Resources

CE7120 semi-automatic profiling lathe electrical schematic circuit 04

Oscillator circuit diagram with separate control of LED on-off time

Silicon temperature sensor temperature measurement circuit

0～35V regulated power supply circuit

Protection switch

LC2210 output connection method

[GD32L233C-START Review] Unboxing: PackageThe packaging is pretty good, with magnets attached. Inside is an anti-static bag containing a board. Although the space is a bit wasted, the box is made of cardboard and is easy to open with m...; hl23889909 GD32 MCU

【DIY Creative LED】Testing the main functions of the circuit: The whole circuit is not complicated, but there are some places that need attention, so as to avoid detours. You can check the hardware in the following order to see if it works properly:power supply ...; dcexpert MCU

[AutoChips AC7801x motor demo board review] + key peripheral test-HALL acquisition: [i=s] This post was last edited by woaixiaxiao on 2020-12-5 12:15[/i]Key peripheral test —— Test of HALL interfaceHardware InterfaceAs described above, the system mainboard integrates a HALL interface...; 我爱下载 Domestic Chip Exchange

CCS uninstallation and installation process and problems encountered: Due to project requirements, the algorithm must be implemented on the multi-core DSP 6678 platform, and it is inevitable to come into contact with CCS. Previously, installing and uninstalling CCS on d...; fish001 Microcontroller MCU

6 Commonly Used C Language Conversion Tool Functions: Some commonly used conversion tool functions in C language! 1. Convert string to hexadecimal Code implementation:void StrToHex(char *pbDest, char *pbSrc, int nLen){char h1,h2;char s1,s2;int i;for (i=0...; Aguilera Microcontroller MCU

LG's new product line promises no highlights: [i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:00[/i]...; aifang Mobile and portable

Popular Components