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BZT52-B4V7S_R2_00001

Description
Maximum power: 200mW Accuracy: - Reverse leakage current: 5uA @ 1V Regulated voltage value (typical value): 4.7V
CategoryDiscrete semiconductor    diode   
File Size290KB,6 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZT52-B4V7S_R2_00001 Overview

Maximum power: 200mW Accuracy: - Reverse leakage current: 5uA @ 1V Regulated voltage value (typical value): 4.7V

BZT52-B4V7S_R2_00001 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionR-PDSO-F2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance78 Ω
JESD-30 codeR-PDSO-F2
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.2 W
Nominal reference voltage4.7 V
surface mountYES
technologyZENER
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance1.91%
Working test current5 mA
Base Number Matches1

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Download Datasheet
BZT52-B2V4S SERIES
SURFACE MOUNT SILICON ZENER DIODES
VOLTAGE
2.4 to 75 Volt
POWER
200 mWatt
FEATURES
• Planar Die construction
• 200mW Power Dissipation
• Zener Voltages from 2.4~75V
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2.0
• Green molding compound as per IEC 61249 standard
0.054(1.35)
0.045(1.15)
0.078(1.95)
0.068(1.75)
0.014(0.35)
0.009(0.25)
0.036(0.90)
0.027(0.70)
MECHANICAL DATA
• Case: SOD-323, Molded Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Apporx. Weight: 0.00014 ounces, 0.0041 grams
0.006(0.15)
0.002(0.05)
0.107(2.7)
0.090(2.3)
0.012(0.30)MIN.
1
Cathode
2
Anode
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation @T
A
=25
o
C(Note A)
Typical Thermal Resistance(Note B)
Operating Junction and Storage Temperature Range
Symbol
P
D
R
θJA
T
J
Value
200
650
-55 to +150
Units
mW
O
C/W
O
C
NOTES:
A. Mounted on a FR-4 PCB, single-sided copper, with 100cm
2
copper pad area.
B. Mounted on a FR-4 PCB, single-sided copper, mini pad.
May 15,2018-REV.08
PAGE . 1
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