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BZT52-B36-AU_R2_000A1

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZT52-B36-AU_R2_000A1 Overview

Zener Diode,

BZT52-B36-AU_R2_000A1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
package instructionSOD-123, 2 PIN
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance90 Ω
Maximum forward voltage (VF)0.9 V
JESD-30 codeR-PDSO-G2
JESD-609 codee3
Maximum knee impedance350 Ω
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation0.41 W
GuidelineAEC-Q101
Nominal reference voltage36 V
Maximum reverse current0.1 µA
Reverse test voltage27 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum voltage tolerance2%
Working test current5 mA
Base Number Matches1

BZT52-B36-AU_R2_000A1 Preview

Download Datasheet
BZT52-B2V4-AU SERIES
SURFACE MOUNT SILICON ZENER DIODES
VOLTAGE
2.4 to 75 Volts
POWER
410 mWatts
0.154(3.90)
0.141(3.60)
0.110(2.80)
0.098(2.50)
FEATURES
• Planar Die construction
• 410mW Power Dissipation
• Zener Voltages from 2.4~75V
• Ideally Suited for Automated Assembly Processes
• Acqire quality system certificate : TS16949
• AEC-Q101 qualified
• Lead free in comply with EU RoHS 2011/65/EU directives
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.008(0.20)MAX.
0.028(0.70)
0.019(0.50)
0.071(1.80)
0.055(1.40)
0.053(1.35)
0.037(0.95)
MECHANICAL DATA
• Case: SOD-123, Molded Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.0004 ounces, 0.01 grams
0.005(0.12)MAX.
0.016(0.40)MIN.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25 C unless otherwise noted)
o
Parameter
Maximum Power Dissipation (Note 1)
Forward Voltage Drop at I
F
=10mA
Junction to Ambient (Note 2)
Thermal Resistance
Junction to Lead
Operating Junction Temperature and StorageTemperature Range
Symbol
Value
410
0.9
430
Units
mW
V
P
D
V
F
R
JA
R
JL
T
J
O
C/W
320
-55 to +150
O
C
1
2
Cathode
Anode
NOTES:
1. Mounted on 48 cm
2
FR-4 PCB .
2. Mounted on an FR-4 PCB, with minimum recommended Pad
November 4,2013
Document Number : 120508
PAGE . 1
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