Intel demonstrates glass substrate for next-generation advanced chip packaging: interconnect density increased by 10 times, lithography pattern distortion reduced by 5

September 19 news, according to a press release on Intel’s official website, Intel has recently launched a glass substrate for next-generation advanced packaging. Babak Sabi, Intel’s senior vice president and general manager of assembly and test development, said, “This innovation has been developed for more than ten years. It took years of research to perfect.”

▲ Picture source Intel

IT House noted from the article that compared with modern organic substrates, the glass substrate has "better thermal properties, physical properties and optical properties" and can increase interconnection density by 10 times. The glass substrate also withstands higher operating temperatures and reduces pattern distortion by 50% through enhanced flatness, which improves lithography’s depth of focus and provides designers with more flexibility in power delivery and signal routing. .

Thanks to the above characteristics, enhanced glass substrate properties can improve assembly yield and reduce waste, allowing chip designers to package more chips (or chip units) in a smaller size of a single package while maximizing the Reduce cost and power consumption.

Intel said it has been "a leader in the semiconductor industry" for decades. In the 1990s, the chipmaker was the first to transition from ceramic to organic packaging and was the first to introduce halogen-free and lead-free packages.

Intel also claimed that the next generation of glass substrates will initially be used in applications that require larger package sizes, such as commercial aspects involving data centers and artificial intelligence. The company expects to offer complete glass substrate solutions starting after 2025 and is on track to achieve 1 trillion transistors on packaging by 2030.