BZT52-B10-AU_R1_000A1 datasheet, PDF

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BZT52-B10-AU_R1_000A1: DescriptionZener Diode,; CategoryDiscrete semiconductor diode; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZT52-B10-AU_R1_000A1 Overview

Zener Diode,

BZT52-B10-AU_R1_000A1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	SOD-123, 2 PIN
Reach Compliance Code	compli
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	15 Ω
Maximum forward voltage (VF)	0.9 V
JESD-30 code	R-PDSO-G2
JESD-609 code	e3
Maximum knee impedance	150 Ω
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.41 W
Guideline	AEC-Q101
Nominal reference voltage	10 V
Maximum reverse current	0.1 µA
Reverse test voltage	7.5 V
surface mount	YES
technology	ZENER
Terminal surface	Tin (Sn)
Terminal form	GULL WING
Terminal location	DUAL
Maximum voltage tolerance	2%
Working test current	5 mA

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BZT52-B2V4-AU SERIES

SURFACE MOUNT SILICON ZENER DIODES

VOLTAGE

2.4 to 75 Volts

POWER

410 mWatts

0.154(3.90)

0.141(3.60)

0.110(2.80)

0.098(2.50)

FEATURES

• Planar Die construction

• 410mW Power Dissipation

• Zener Voltages from 2.4~75V

• Ideally Suited for Automated Assembly Processes

• Acqire quality system certificate : TS16949

• AEC-Q101 qualified

• Lead free in comply with EU RoHS 2011/65/EU directives

• Green molding compound as per IEC61249 Std. . (Halogen Free)

0.008(0.20)MAX.

0.028(0.70)

0.019(0.50)

0.071(1.80)

0.055(1.40)

0.053(1.35)

0.037(0.95)

MECHANICAL DATA

• Case: SOD-123, Molded Plastic

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight: 0.0004 ounces, 0.01 grams

0.005(0.12)MAX.

0.016(0.40)MIN.

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T

=25 C unless otherwise noted)

Parameter

Maximum Power Dissipation (Note 1)

Forward Voltage Drop at I

=10mA

Junction to Ambient (Note 2)

Thermal Resistance

Junction to Lead

Operating Junction Temperature and StorageTemperature Range

Symbol

Value

410

0.9

430

Units

JA

JL

C/W

320

-55 to +150

Cathode

Anode

NOTES:

1. Mounted on 48 cm

FR-4 PCB .

2. Mounted on an FR-4 PCB, with minimum recommended Pad

November 4,2013

Document Number : 120508

PAGE . 1

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