BAW56LT1 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> diode> BAW56LT1

BAW56LT1: DescriptionRectifier Diode, 0.2A, 70V V(RRM); CategoryDiscrete semiconductor diode; File Size35KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Parametric View All

BAW56LT1 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	BAW56LT1	-	-	View	Buy Now

BAW56LT1 Overview

Rectifier Diode, 0.2A, 70V V(RRM)

BAW56LT1 Parametric

Parameter Name	Attribute value
Maker	JCET
Reach Compliance Code	unknown
Diode type	RECTIFIER DIODE
Maximum forward voltage (VF)	0.715 V
Maximum operating temperature	150 °C
Maximum output current	0.2 A
Maximum repetitive peak reverse voltage	70 V
Maximum reverse recovery time	0.006 µs
surface mount	YES

BAW56LT1 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-23 Plastic-Encapsulate Diodes

BAW56LT1

FEATURES

Power dissipation

225

mW (Tamb=25℃)

1. 0

SWITCHING DIODE

SOT-23

Forward Current

200 m A

Reverse Voltage

Operating and storage junction temperature range

, T

stg

: -55℃ to +150℃

2. 4

1. 3

2. 9

1. 9

0. 95

Unit: mm

M ki ng A1

ELECTRICAL CHARACTERISTICS (Tamb=25℃

Parameter

Reverse breakdown voltage

Reverse voltage

leakage current

Symbol

(BR)

unless otherwise specified)

Test

conditions

MIN

2.5

MAX

UNIT

= 100

=70V

0. 4

=1mA

Forward

voltage

=10mA

=50mA

=150mA

Diode

capacitance

715

855

1000

1250

=0V, f=1MHz

Reverse recovery time

Recommended Resources

A circuit diagram integrating a charging management module

PTC three-phase asynchronous motor protection circuit 7

smoke detector alarm

Anti-tremor circuit using NAND gate

50kHz Meacham bridge oscillator

Color TV remote control 28

Temperature Problem Solved for You (V) Efficient Cold Chain Management through Scalable Temperature Sensors: In previous articles, we have introduced the basic principles of temperature sensors. In order to preserve nutrients and ensure quality and product safety, manufacturers specify the transportation and...; EEWORLD社区 TI Technology Forum

Field Programmable Gate Array is...? ?: When I talk to people about FPGAs , I hear a lot of people say, " I don't know how they work , " " They're too complicated , " and " I can't program them in C. " I hate to see such an amazing device g...; mdy-吴伟杰 FPGA/CPLD

High-pass filter, low-pass filter, band-pass filter, band-stop filter, detector and frequency selection: High-pass filter, low-pass filter, band-pass filter, band-stop filter, detector and frequency selection1. These filters require op amp + capacitor to be implemented. Are there any integrated filter ch...; QWE4562009 Discrete Device

Zero-based temperature and humidity monitoring host computer: [i=s]This post was last edited by Fillmore on 2020-7-31 18:29[/i]PrefaceMany netizens asked me what language is good for writing a host computer. C#, C++, Python, etc. can all be used, but you must le...; Fillmore Real-time operating system RTOS

[Analog Electronics Course Selection Test] Choose, Study, and Score: Use the analog electronics course selection test function to select a course for study. The basic operations are: 1. Select learning goals, learning levels (or details) 2. Get recommended class schedu...; tobot TI Technology Forum

Desktop Assistant Based on GD32F350——Supplementary Video: [i=s]This post was last edited by sptt1 on 2018-11-4 23:22[/i] [media=x,1920,1080]http://v.youku.com/v_show/id_XMzkwNDAyODQ1Mg==.html[/media]...; sptt1 GD32 MCU

Popular Components